Simulation for Enhancing Automotive Power Module DBC Reliability During Assembly Process
Yong Liu, Qiuxiao Qian
Published in 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) (01.05.2018)
Published in 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) (01.05.2018)
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Conference Proceeding
Board level solder reliability simulation for epoxy mold compound based power package
Qiuxiao Qian, Yong Liu
Published in 2017 IEEE 19th Electronics Packaging Technology Conference (EPTC) (01.12.2017)
Published in 2017 IEEE 19th Electronics Packaging Technology Conference (EPTC) (01.12.2017)
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Conference Proceeding
Semiconductor Power Package Bonding Interconnects Reliability Simulation under Transient Thermal Loads
Qiuxiao Qian, Stout, Roger, Yong Liu
Published in 2017 IEEE 67th Electronic Components and Technology Conference (ECTC) (01.05.2017)
Published in 2017 IEEE 67th Electronic Components and Technology Conference (ECTC) (01.05.2017)
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Conference Proceeding
Investigation of warpage induced reliability of a system in package in assembly process
Qiuxiao Qian, Yong Liu
Published in 2014 15th International Conference on Electronic Packaging Technology (01.05.2014)
Published in 2014 15th International Conference on Electronic Packaging Technology (01.05.2014)
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Conference Proceeding
Multiphysics modeling for current carrying capability of a power package
Qiuxiao Qian, Yumin Liu, Yong Liu
Published in 2014 15th International Conference on Thermal, Mechanical and Mulit-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) (01.04.2014)
Published in 2014 15th International Conference on Thermal, Mechanical and Mulit-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) (01.04.2014)
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Conference Proceeding
Modeling for critical design and performance of wafer level chip scale package
Yong Liu, Qiuxiao Qian, Ring, Matt, Jihwan Kim, Kinzer, D.
Published in 2012 IEEE 62nd Electronic Components and Technology Conference (01.05.2012)
Published in 2012 IEEE 62nd Electronic Components and Technology Conference (01.05.2012)
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Conference Proceeding
Investigation of the assembly reflow process and PCB design on the reliability of WLCSP
Yong Liu, Qiuxiao Qian, Shichun Qu, Martin, S., Jeon, O.
Published in 2012 IEEE 62nd Electronic Components and Technology Conference (01.05.2012)
Published in 2012 IEEE 62nd Electronic Components and Technology Conference (01.05.2012)
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Conference Proceeding
Design and assembly process simulation for an automotive power module
Yong Liu, Qiuxiao Qian, Byoungok Lee, Taekkeun Lee, Joonseo Son, Oseob Jeon
Published in 2013 IEEE 63rd Electronic Components and Technology Conference (01.05.2013)
Published in 2013 IEEE 63rd Electronic Components and Technology Conference (01.05.2013)
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Conference Proceeding
Wire bonding capillary profile and bonding process parameter optimization simulation
Qiuxiao Qian, Yong liu, Timwah Luk, Irving, S.
Published in EuroSimE 2008 - International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Micro-Systems (01.04.2008)
Published in EuroSimE 2008 - International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Micro-Systems (01.04.2008)
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Conference Proceeding
Impact of wedge wire bonding and thermal mechanical stress on reliability of BPSG/poly layer of a silicon die
Yong Liu, Irving, S., Luk, T., Rioux, M., Qiuxiao Qian
Published in 2008 58th Electronic Components and Technology Conference (01.05.2008)
Published in 2008 58th Electronic Components and Technology Conference (01.05.2008)
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Conference Proceeding
Analysis of the Impact of Polyimide Coating on Passivation Reliability by Simulation
Qiuxiao Qian, Yong Liu, Irving, Scott, Timwah Luk
Published in 2007 Proceedings 57th Electronic Components and Technology Conference (01.05.2007)
Published in 2007 Proceedings 57th Electronic Components and Technology Conference (01.05.2007)
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Conference Proceeding
Simulation and Analysis for Lead Frame Bending Impact to Assembly Singulation Process
Qiuxiao Qian, Yong Liu, Irving, S., Hua Yang, Yang Zhang
Published in 2006 7th International Conference on Electronic Packaging Technology (01.08.2006)
Published in 2006 7th International Conference on Electronic Packaging Technology (01.08.2006)
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Conference Proceeding
Reliability study of ceramic substrate in a SIP type package
Yumin Liu, Yong Liu, Yang, J., Qiuxiao Qian, Irving, S.
Published in 2005 6th International Conference on Electronic Packaging Technology (2005)
Published in 2005 6th International Conference on Electronic Packaging Technology (2005)
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Conference Proceeding