A measurement of the distribution of argon in sputter- deposited very large scale integration metallization
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Journal Article
Conference Proceeding
Ti-thickness dependent electromigration resistance of the Al-Cu-Si/TiN/sub x//TiSi/sub y/ barrier contact system
Fu, K.-Y., Travis, E., Sun, S.W., Grove, C.L., Pyle, R.E., Pintchovski, F., Schani, P.
Published in Proceedings., Sixth International IEEE VLSI Multilevel Interconnection Conference (1989)
Published in Proceedings., Sixth International IEEE VLSI Multilevel Interconnection Conference (1989)
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Conference Proceeding