The microstructure of Sn in near-eutectic Sn–Ag–Cu alloy solder joints and its role in thermomechanical fatigue
Henderson, Donald W., Woods, James J., Gosselin, Timothy A., Bartelo, Jay, King, David E., Korhonen, T.M., Korhonen, M.A., Lehman, L.P., Cotts, E.J., Kang, Sung K., Lauro, Paul, Shih, Da-Yuan, Goldsmith, Charles, Puttlitz, Karl J.
Published in Journal of materials research (01.06.2004)
Published in Journal of materials research (01.06.2004)
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Journal Article
Ag3Sn plate formation in the solidification of near-ternary eutectic Sn-Ag-Cu
Kang, Sung K., Shih, Da-Yuan, Donald, NY, Henderson, W., Gosselin, Timothy, Sarkhel, Amit, Charles Goldsmith, NY, Puttlitz, Karl J., Choi, Won Kyoung
Published in JOM (1989) (01.06.2003)
Published in JOM (1989) (01.06.2003)
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Journal Article
Interfacial reaction studies on lead (Pb)-free solder alloys
Kang, S.K., Shih, D.Y., Fogel, K., Lauro, P., Myung-Jin Yim, Advocate, G.G., Griffin, M., Goldsmith, C., Henderson, D.W., Gosselin, T.A., King, D.E., Konrad, J.J., Sarkhel, A., Puttlitz, K.J.
Published in IEEE transactions on electronics packaging manufacturing (01.07.2002)
Published in IEEE transactions on electronics packaging manufacturing (01.07.2002)
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Journal Article
Ag3Sn plate formation in the solidification of near ternary eutectic Sn–Ag–Cu alloys
Henderson, Donald W., Gosselin, Timothy, Sarkhel, Amit, Kang, Sung K., Choi, Won-Kyoung, Shih, Da-Yuan, Goldsmith, Charles, Puttlitz, Karl J.
Published in Journal of materials research (01.11.2002)
Published in Journal of materials research (01.11.2002)
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Journal Article
Interfacial reaction studies on lead (Pb)-free solder alloys
Kang, S.K., Shih, D.Y., Fogel, K., Lauro, P., Yim, M.J., Advocate, G., Griffin, M., Goldsmith, C., Henderson, D.W., Gosselin, T., King, D., Konrad, J., Sarkhel, A., Puttlitz, K.J.
Published in 2001 Proceedings. 51st Electronic Components and Technology Conference (Cat. No.01CH37220) (2001)
Published in 2001 Proceedings. 51st Electronic Components and Technology Conference (Cat. No.01CH37220) (2001)
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Conference Proceeding
Ag sub 3 Sn plate formation in the solidification of near ternary eutectic Sn-Ag-Cu alloys
Henderson, D W, Gosselin, T, Sarkhel, A, Kang, S K, Choi, W-K, Shih, D-Y, Goldsmith, C, Puttlitz, K J
Published in Journal of materials research (01.11.2002)
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Published in Journal of materials research (01.11.2002)
Journal Article
Mechanical properties of near-eutectic Sn-Ag-Cu alloy over a wide range of temperatures and strain rates
KORHONEN, Tia-Marje K, TURPEINEN, Pekka, LEHMAN, Lawrence P, BOWMAN, Brian, THIEL, George H, PARKES, Raymond C, KORHONEN, Matt A, HENDERSON, Donald W, PUTTLITZ, Karl J
Published in Journal of electronic materials (01.12.2004)
Published in Journal of electronic materials (01.12.2004)
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Conference Proceeding
Journal Article
Corrosion of Pb-50In flip-chip interconnections exposed to harsh environment
Puttlitz, K.J.
Published in IEEE transactions on components, hybrids, and manufacturing technology (01.03.1990)
Published in IEEE transactions on components, hybrids, and manufacturing technology (01.03.1990)
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Journal Article
Solder transfer technique for flip chip and electronic assembly applications
Puttlitz, K.J., Lidestri, K.A., Totta, P.A.
Published in 1996 Proceedings 46th Electronic Components and Technology Conference (1996)
Published in 1996 Proceedings 46th Electronic Components and Technology Conference (1996)
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Conference Proceeding
Journal Article
C-4/BGA comparison with other MLC single chip package alternatives
Puttlitz, K.J., Shutler, W.F.
Published in 1994 Proceedings. 44th Electronic Components and Technology Conference (1994)
Published in 1994 Proceedings. 44th Electronic Components and Technology Conference (1994)
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Conference Proceeding