Low-Frequency Shielding Effectiveness of Magnetic Alloys
Duhni, Ghaleb Al, Khasgiwala, Mudit, Volakis, John L., Markondeya Raj, Pulugurtha
Published in SoutheastCon 2023 (01.04.2023)
Published in SoutheastCon 2023 (01.04.2023)
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Conference Proceeding
Component-Level Shielding with Assembled Copper Trenches in Package Slots
Duhni, Ghaleb Al, Khasgiwala, Mudit, Volakis, John L., Markondeya Raj, Pulugurtha
Published in SoutheastCon 2023 (01.04.2023)
Published in SoutheastCon 2023 (01.04.2023)
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Conference Proceeding
Ultrathin Antenna-Integrated Glass-Based Millimeter-Wave Package With Through-Glass Vias
Watanabe, Atom O., Lin, Tong-Hong, Ali, Muhammad, Wang, Yiteng, Smet, Vanessa, Raj, Pulugurtha Markondeya, Tentzeris, Manos M., Tummala, Rao R., Swaminathan, Madhavan
Published in IEEE transactions on microwave theory and techniques (01.12.2020)
Published in IEEE transactions on microwave theory and techniques (01.12.2020)
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Journal Article
Wideband Power/Ground Noise Suppression in Low-Loss Glass Interposers Using a Double-Sided Electromagnetic Bandgap Structure
Kim, Youngwoo, Park, Gapyeol, Cho, Kyungjun, Raj, Pulugurtha Markondeya, Tummala, Rao R., Kim, Joungho
Published in IEEE transactions on microwave theory and techniques (01.12.2020)
Published in IEEE transactions on microwave theory and techniques (01.12.2020)
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Journal Article
Sintered Nanocopper Paste for High-Performance 3D Heterogeneous Package Integration
Wang, Yiteng, Watanabe, Atom O., Ogura, Nobuo, Raj, Pulugurtha Markondeya, Tummala, Rao
Published in Journal of electronic materials (01.11.2020)
Published in Journal of electronic materials (01.11.2020)
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Journal Article
Broadband and Miniaturized Antenna-in-Package (AiP) Design for 5G Applications
Lin, Tong-Hong, Kanno, Kimiyuki, Watanabe, Atom O., Raj, Pulugurtha Markondeya, Tummala, Rao R., Swaminathan, Madhavan, Tentzeris, Manos M.
Published in IEEE antennas and wireless propagation letters (01.11.2020)
Published in IEEE antennas and wireless propagation letters (01.11.2020)
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Journal Article
Measurement and Analysis of Through Glass Via Noise Coupling and Shielding Structures in a Glass Interposer
Park, Gapyeol, Kim, Youngwoo, Cho, Kyungjun, Park, Junyong, Hwang, Insu, Kim, Jihye, Son, Kyungjune, Park, Hyunwook, Watanabe, Atom O., Raj, Pulugurtha Markondeya, Tummala, Rao R., Kim, Joungho
Published in IEEE transactions on electromagnetic compatibility (01.10.2021)
Published in IEEE transactions on electromagnetic compatibility (01.10.2021)
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Journal Article
Prefabricated and Assembled Electromagnetic Shields Inside Electronic Packages to Reduce Near-Field Capacitive and Inductive Coupling
Al-Duhni, Ghaleb Saleh Ghaleb, Khasgiwala, Mudit, Volakis, John L., Raj, Pulugurtha Markondeya
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.06.2024)
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.06.2024)
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Journal Article
Low-Loss Impedance-Matched Sub-25-μm Vias in 3-D Millimeter-Wave Packages
Watanabe, Atom O., Ito, Hirokazu, Markondeya, Raj Pulugurtha, Tummala, Rao R., Swaminathan, Madhavan
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.05.2020)
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.05.2020)
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Journal Article
Reliability of Fine-Pitch μm-Diameter Microvias for High-Density Interconnects
Dwarakanath, Shreya, Kakutani, Takenori, Okamoto, Daichi, Raj, Pulugurtha Markondeya, Swaminathan, Madhavan, Tummala, Rao R.
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.09.2020)
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.09.2020)
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Journal Article
Wireless Fully-Passive Package-Embedded Seismocardiogram with RF Backscattering
Sayeed, Sk Yeahia Been, Navaz, Hooman Vatan, Volakis, John L., Raj, Pulugurtha Markondeya
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.09.2023)
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.09.2023)
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Journal Article
Ultralow-Loss Substrate-Integrated Waveguides in Glass-Based Substrates for Millimeter-Wave Applications
Watanabe, Atom O., Tehrani, Bijan K., Ogawa, Tomonori, Raj, Pulugurtha Markondeya, Tentzeris, Manos M., Tummala, Rao R.
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.03.2020)
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.03.2020)
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Journal Article
Miniaturized Fully-Passive Wireless Neural Recording with Heterogeneous Integration in Thin Packages
Sayeed, Sk Yeahia Been, Venkatakrishnan, Satheesh B, Volakis, John L., Raj, Pulugurtha Markondeya
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.03.2023)
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.03.2023)
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Journal Article
3-D Packaging and Integration of High-Density Tantalum Capacitors on Silicon
Spurney, Robert Grant, Sharma, Himani, Raj, Pulugurtha Markondeya, Tummala, Rao, Lollis, Naomi, Weaver, Mitch, Romig, Matt, Gandhi, Saumya, Brumm, Holger
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.08.2019)
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.08.2019)
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Journal Article
Glass Interposer Electromagnetic Bandgap Structure for Efficient Suppression of Power/Ground Noise Coupling
Youngwoo Kim, Jonghyun Cho, Kim, Jonghoon J., Kyungjun Cho, Subin Kim, Sitaraman, Srikrishna, Sundaram, Venky, Raj, Pulugurtha Markondeya, Tummala, Rao R., Joungho Kim
Published in IEEE transactions on electromagnetic compatibility (01.06.2017)
Published in IEEE transactions on electromagnetic compatibility (01.06.2017)
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Journal Article
Measurement and Analysis of Glass Interposer Power Distribution Network Resonance Effects on a High-Speed Through Glass Via Channel
Youngwoo Kim, Jonghyun Cho, Kim, Jonghoon J., Kiyeong Kim, Kyungjun Cho, Subin Kim, Sitaraman, Srikrishna, Sundaram, Venky, Raj, Pulugurtha Markondeya, Tummala, Rao, Joungho Kim
Published in IEEE transactions on electromagnetic compatibility (01.12.2016)
Published in IEEE transactions on electromagnetic compatibility (01.12.2016)
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Journal Article