A Novel Submicron Polymer Re-Distribution Layer Technology for Advanced InFO Packaging
Han-Ping Pu, Kuo, H. J., Liu, C. S., Yu, Douglas C. H.
Published in 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) (01.05.2018)
Published in 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) (01.05.2018)
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Conference Proceeding
Signal Integrity of Submicron InFO Heterogeneous Integration for High Performance Computing Applications
Wang, Chuei-Tang, Hsieh, Jeng-Shien, Chang, Victor C. Y., Huang, Shih-Ya, Ko, T., Pu, Han-Ping, Yu, Douglas
Published in 2019 IEEE 69th Electronic Components and Technology Conference (ECTC) (01.05.2019)
Published in 2019 IEEE 69th Electronic Components and Technology Conference (ECTC) (01.05.2019)
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Conference Proceeding
High Q-factor 3D Solenoid Inductor on InFO Package for RF System Integration
Tang, Tzu-Chun, Lin, Chia-Chia, Hsu, Che-Wei, Lu, Chun-Lin, Tsai, Chung-Hao, Wu, Kai-Chiang, Pu, Han-Ping, Liu, Chung-Shi, Wang, Chuei-Tang, Yu, Doug
Published in 2019 Electrical Design of Advanced Packaging and Systems (EDAPS) (01.12.2019)
Published in 2019 Electrical Design of Advanced Packaging and Systems (EDAPS) (01.12.2019)
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Conference Proceeding
Semiconductor device having antenna and manufacturing method thereof
Wan, Albert, Shih, Chao-Wen, Hsieh, Ching-Hua, Chen, Meng-Tse, Pu, Han-Ping, Chiu, Sheng-Hsiang
Year of Publication 06.08.2024
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Year of Publication 06.08.2024
Patent
Conductive Traces in Semiconductor Devices and Methods of Forming Same
Yu, Chen-Hua, Shih, Chao-Wen, Pu, Han-Ping, Tsai, Hao-Yi, Hsu, Sen-Kuei, Pan, Hsin-Yu
Year of Publication 25.04.2024
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Year of Publication 25.04.2024
Patent
Conductive traces in semiconductor devices and methods of forming same
Yu, Chen-Hua, Shih, Chao-Wen, Pu, Han-Ping, Tsai, Hao-Yi, Hsu, Sen-Kuei, Pan, Hsin-Yu
Year of Publication 06.02.2024
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Year of Publication 06.02.2024
Patent
Semiconductor package and manufacturing method thereof
Lu, Chun-Lin, Wu, Kai-Chiang, Hsu, Chung-Yi, Wang, Yen-Ping, Pu, Han-Ping
Year of Publication 31.01.2023
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Year of Publication 31.01.2023
Patent
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
Lu, Chun-Lin, Wu, Kai-Chiang, Hsu, Chung-Yi, Wang, Yen-Ping, Pu, Han-Ping
Year of Publication 10.11.2022
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Year of Publication 10.11.2022
Patent
SEMICONDUCTOR DEVICE HAVING ANTENNA AND MANUFACTURING METHOD THEREOF
Wan, Albert, Shih, Chao-Wen, Hsieh, Ching-Hua, Chen, Meng-Tse, Pu, Han-Ping, Chiu, Sheng-Hsiang
Year of Publication 28.09.2023
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Year of Publication 28.09.2023
Patent
Semiconductor device having antenna on chip package and manufacturing method thereof
Wan, Albert, Shih, Chao-Wen, Hsieh, Ching-Hua, Chen, Meng-Tse, Pu, Han-Ping, Chiu, Sheng-Hsiang
Year of Publication 18.07.2023
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Year of Publication 18.07.2023
Patent