by Guo-Quan Lu, Calata, J.N., Zhiye Zhang, Bai, J.G.
Published in Proceedings of the Sixth IEEE CPMT Conference on High Density Microsystem Design and Packaging and Component Failure Analysis (HDP '04) (2004)

by Li Jianping, Deng Guiling
Published in Proceedings of the Sixth IEEE CPMT Conference on High Density Microsystem Design and Packaging and Component Failure Analysis (HDP '04) (2004)

by Zhimin Mo, Anderson, J., Liu, J.
Published in Proceedings of the Sixth IEEE CPMT Conference on High Density Microsystem Design and Packaging and Component Failure Analysis (HDP '04) (2004)

by Law, C.M.T., Wu, C.M.L.
Published in Proceedings of the Sixth IEEE CPMT Conference on High Density Microsystem Design and Packaging and Component Failure Analysis (HDP '04) (2004)

by Liqiang Cao, Zonghe Lai, Liu, J.
Published in Proceedings of the Sixth IEEE CPMT Conference on High Density Microsystem Design and Packaging and Component Failure Analysis (HDP '04) (2004)

by Lin Xuechun, Lin Feng
Published in Proceedings of the Sixth IEEE CPMT Conference on High Density Microsystem Design and Packaging and Component Failure Analysis (HDP '04) (2004)

by Jan Vardaman, E., Matthew, L.
Published in Proceedings of the Sixth IEEE CPMT Conference on High Density Microsystem Design and Packaging and Component Failure Analysis (HDP '04) (2004)

by Kristiansen, H., Gronlund, T.O., Liu, J.
Published in Proceedings of the Sixth IEEE CPMT Conference on High Density Microsystem Design and Packaging and Component Failure Analysis (HDP '04) (2004)

by Inoue, M., Miyamoto, T., Suganuma, K.
Published in Proceedings of the Sixth IEEE CPMT Conference on High Density Microsystem Design and Packaging and Component Failure Analysis (HDP '04) (2004)

by Maruo, H., Seki, Y., Unami, Y.
Published in Proceedings of the Sixth IEEE CPMT Conference on High Density Microsystem Design and Packaging and Component Failure Analysis (HDP '04) (2004)

by Li, L.
Published in Proceedings of the Sixth IEEE CPMT Conference on High Density Microsystem Design and Packaging and Component Failure Analysis (HDP '04) (2004)

by Lu Junhui, Tan Jianping, Han Lei, Zhong Jue
Published in Proceedings of the Sixth IEEE CPMT Conference on High Density Microsystem Design and Packaging and Component Failure Analysis (HDP '04) (2004)

by Zhaonian Cheng, Weidong Huang, Xia Cai, Bulu Xu, Le Luo, Xinxin Li
Published in Proceedings of the Sixth IEEE CPMT Conference on High Density Microsystem Design and Packaging and Component Failure Analysis (HDP '04) (2004)

by Wang Lei, Wu Fengshun, Wu Yiping, Zhang Jinsong
Published in Proceedings of the Sixth IEEE CPMT Conference on High Density Microsystem Design and Packaging and Component Failure Analysis (HDP '04) (2004)

by Hirafune, S., Yamamoto, S., Wada, H., Okanishi, K., Tomita, M., Matsumaru, K., Suemasu, T.
Published in Proceedings of the Sixth IEEE CPMT Conference on High Density Microsystem Design and Packaging and Component Failure Analysis (HDP '04) (2004)

by Guangbin Dou, Whalley, D.C., Changqing Liu
Published in Proceedings of the Sixth IEEE CPMT Conference on High Density Microsystem Design and Packaging and Component Failure Analysis (HDP '04) (2004)

by Long Zhili, Wu Yunxin, Han Lei, Li Jianping, Zhou Hongquan
Published in Proceedings of the Sixth IEEE CPMT Conference on High Density Microsystem Design and Packaging and Component Failure Analysis (HDP '04) (2004)

by Matsuda, K., Watanabe, I.
Published in Proceedings of the Sixth IEEE CPMT Conference on High Density Microsystem Design and Packaging and Component Failure Analysis (HDP '04) (2004)

by Wu, C.M.L., Law, C.M.T.
Published in Proceedings of the Sixth IEEE CPMT Conference on High Density Microsystem Design and Packaging and Component Failure Analysis (HDP '04) (2004)

by Biye Wang
Published in Proceedings of the Sixth IEEE CPMT Conference on High Density Microsystem Design and Packaging and Component Failure Analysis (HDP '04) (2004)