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Low temperature soldering on biopolymer (PLA) Printed Wiring Board substrate
Geczy, A., Lener, V., Hajdu, I., Illyefalvi-Vitez, Z.
Published in Proceedings of the 2011 34th International Spring Seminar on Electronics Technology (ISSE) (01.05.2011)
Published in Proceedings of the 2011 34th International Spring Seminar on Electronics Technology (ISSE) (01.05.2011)
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Comparing the intermetallic layer formation of Infrared and Vapour Phase soldering
Krammer, O., Garami, T.
Published in Proceedings of the 2011 34th International Spring Seminar on Electronics Technology (ISSE) (01.05.2011)
Published in Proceedings of the 2011 34th International Spring Seminar on Electronics Technology (ISSE) (01.05.2011)
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Boundary value of rheological properties of solder paste
Pietrikova, A., Kravcik, M.
Published in Proceedings of the 2011 34th International Spring Seminar on Electronics Technology (ISSE) (01.05.2011)
Published in Proceedings of the 2011 34th International Spring Seminar on Electronics Technology (ISSE) (01.05.2011)
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The ontology based FMEA of lead free soldering process
Molhanec, M., Zhuravskaya, O., Povolotskaya, E., Tarba, L.
Published in Proceedings of the 2011 34th International Spring Seminar on Electronics Technology (ISSE) (01.05.2011)
Published in Proceedings of the 2011 34th International Spring Seminar on Electronics Technology (ISSE) (01.05.2011)
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Conference Proceeding
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Reliability of SnAgCu solder joints during vibration in various temperature
Matkowski, P.
Published in Proceedings of the 2011 34th International Spring Seminar on Electronics Technology (ISSE) (01.05.2011)
Published in Proceedings of the 2011 34th International Spring Seminar on Electronics Technology (ISSE) (01.05.2011)
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Methods for pads thermophysical parameters assessment in terms of 4P Soldering Model
Plotog, I., Mihailescu, B., Pencea, I., Branzei, M., Svasta, P., Cucu, T., Tarcolea, M.
Published in Proceedings of the 2011 34th International Spring Seminar on Electronics Technology (ISSE) (01.05.2011)
Published in Proceedings of the 2011 34th International Spring Seminar on Electronics Technology (ISSE) (01.05.2011)
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Application of copper-Carbon Nanotubes composite in packaging interconnects
Aryasomayajula, L., Rieske, R., Wolter, K.
Published in Proceedings of the 2011 34th International Spring Seminar on Electronics Technology (ISSE) (01.05.2011)
Published in Proceedings of the 2011 34th International Spring Seminar on Electronics Technology (ISSE) (01.05.2011)
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Contact resistance in Polytriarylamine based organic transistors
Bonea, A., Bonfert, D., Svasta, P.
Published in Proceedings of the 2011 34th International Spring Seminar on Electronics Technology (ISSE) (01.05.2011)
Published in Proceedings of the 2011 34th International Spring Seminar on Electronics Technology (ISSE) (01.05.2011)
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Conference Proceeding
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Inkjet printed electrically conductive structures for microelectronics
Felba, J.
Published in Proceedings of the 2011 34th International Spring Seminar on Electronics Technology (ISSE) (01.05.2011)
Published in Proceedings of the 2011 34th International Spring Seminar on Electronics Technology (ISSE) (01.05.2011)
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Assembly and interconnection technologies for MID based on thermally conductive plastics for heat dissipation
Hoerber, J., Mueller, M., Franke, J., Ranft, F., Heinle, C., Drummer, D.
Published in Proceedings of the 2011 34th International Spring Seminar on Electronics Technology (ISSE) (01.05.2011)
Published in Proceedings of the 2011 34th International Spring Seminar on Electronics Technology (ISSE) (01.05.2011)
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TiAl-based ohmic contacts on p-type SiC
Mysliwiec, M., Sochacki, M., Kisiel, R., Guziewicz, M., Wzorek, M.
Published in Proceedings of the 2011 34th International Spring Seminar on Electronics Technology (ISSE) (01.05.2011)
Published in Proceedings of the 2011 34th International Spring Seminar on Electronics Technology (ISSE) (01.05.2011)
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Finite element modeling on thermal fatigue of BGA solder joints with multiple voids
Schwerz, R., Meyer, S., Roellig, M., Meier, K., Wolter, K.
Published in Proceedings of the 2011 34th International Spring Seminar on Electronics Technology (ISSE) (01.05.2011)
Published in Proceedings of the 2011 34th International Spring Seminar on Electronics Technology (ISSE) (01.05.2011)
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Temperature control system based on adaptive PID algorithm implemented in FPAA
Visan, D. A., Lita, I., Cioc, I. B.
Published in Proceedings of the 2011 34th International Spring Seminar on Electronics Technology (ISSE) (01.05.2011)
Published in Proceedings of the 2011 34th International Spring Seminar on Electronics Technology (ISSE) (01.05.2011)
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Dependency of silver nanoparticles protective layers on sintering temperature of printed conductive structures
Smolarek, A., Moscicki, A., Kinart, A., Felba, J., Falat, T.
Published in Proceedings of the 2011 34th International Spring Seminar on Electronics Technology (ISSE) (01.05.2011)
Published in Proceedings of the 2011 34th International Spring Seminar on Electronics Technology (ISSE) (01.05.2011)
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Multimodal biometric securing methods for informatic systems
Soviany, S., Jurian, M.
Published in Proceedings of the 2011 34th International Spring Seminar on Electronics Technology (ISSE) (01.05.2011)
Published in Proceedings of the 2011 34th International Spring Seminar on Electronics Technology (ISSE) (01.05.2011)
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Conference Proceeding
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Contradictory electrochemical migration behavior of copper and lead
Medgyes, B., Illes, B.
Published in Proceedings of the 2011 34th International Spring Seminar on Electronics Technology (ISSE) (01.05.2011)
Published in Proceedings of the 2011 34th International Spring Seminar on Electronics Technology (ISSE) (01.05.2011)
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Conference Proceeding
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Shear strength of joints made of lead-free solders
Podzemsky, J., Urbanek, J., Dusek, K.
Published in Proceedings of the 2011 34th International Spring Seminar on Electronics Technology (ISSE) (01.05.2011)
Published in Proceedings of the 2011 34th International Spring Seminar on Electronics Technology (ISSE) (01.05.2011)
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Conference Proceeding