Flip-chip on FR-4 integrated circuit packaging
Powell, D.O., Trivedi, A.K.
Published in Proceedings of IEEE 43rd Electronic Components and Technology Conference (ECTC '93) (1993)
Published in Proceedings of IEEE 43rd Electronic Components and Technology Conference (ECTC '93) (1993)
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Conference Proceeding
Flip-chip encapsulation on ceramic substrates
Clementi, J., McCreary, J., Niu, T.M., Palomaki, J., Varcoe, J., Hill, G.
Published in Proceedings of IEEE 43rd Electronic Components and Technology Conference (ECTC '93) (1993)
Published in Proceedings of IEEE 43rd Electronic Components and Technology Conference (ECTC '93) (1993)
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Conference Proceeding
Encapsulants used in flip-chip packages
Suryanarayana, D., Wu, T.Y., Varcoe, J.A.
Published in Proceedings of IEEE 43rd Electronic Components and Technology Conference (ECTC '93) (1993)
Published in Proceedings of IEEE 43rd Electronic Components and Technology Conference (ECTC '93) (1993)
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Conference Proceeding
SS-1 supercomputer cooling system
Ing, P., Sperry, C., Philstrom, R., Claybaker, P., Webster, J., Cree, R.
Published in Proceedings of IEEE 43rd Electronic Components and Technology Conference (ECTC '93) (1993)
Published in Proceedings of IEEE 43rd Electronic Components and Technology Conference (ECTC '93) (1993)
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Conference Proceeding
An aluminum nitride package for 300/spl deg/C operation
Bloom, T.R.
Published in Proceedings of IEEE 43rd Electronic Components and Technology Conference (ECTC '93) (1993)
Published in Proceedings of IEEE 43rd Electronic Components and Technology Conference (ECTC '93) (1993)
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Conference Proceeding
Manufacture of advanced Cu-PI multi chip modules
Rao, V., Hutchins, D., Reagan, J., Scheid, D., Streif, R., Syrstad, T., Eggerding, C., Redmond, T.
Published in Proceedings of IEEE 43rd Electronic Components and Technology Conference (ECTC '93) (1993)
Published in Proceedings of IEEE 43rd Electronic Components and Technology Conference (ECTC '93) (1993)
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Conference Proceeding
High K thick film and tape material
Dychala, D.H., Bless, P.W., Wahlers, R.L., Stein, S.J.
Published in Proceedings of IEEE 43rd Electronic Components and Technology Conference (ECTC '93) (1993)
Published in Proceedings of IEEE 43rd Electronic Components and Technology Conference (ECTC '93) (1993)
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Conference Proceeding
Four-channel receiver optoelectronic integrated circuit arrays for ultra-high speed optical interconnects
Nishiyama, N., Sasaki, G., Yano, H., Murata, M., Kamiyama, H., Hayashi, H.
Published in Proceedings of IEEE 43rd Electronic Components and Technology Conference (ECTC '93) (1993)
Published in Proceedings of IEEE 43rd Electronic Components and Technology Conference (ECTC '93) (1993)
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Conference Proceeding
Integrated optical switches on InP for network configuration and distribution
Achatz, V., Eichinger, S., Greil, A., Haltenorth, H., Muller, G., Muller-Nawrath, R., Sauer, B., Schienle, M., Stoll, L., Taumberger, F., Thulke, W., Wenger, G., Westermeier, H., Wolff, U.
Published in Proceedings of IEEE 43rd Electronic Components and Technology Conference (ECTC '93) (1993)
Published in Proceedings of IEEE 43rd Electronic Components and Technology Conference (ECTC '93) (1993)
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Conference Proceeding
Fabrication of fluorinated polyimide waveguides on copper-polyimide multilayer substrates for opto-electronic multichip modules
Shimokawa, F., Koike, S., Matsuura, T.
Published in Proceedings of IEEE 43rd Electronic Components and Technology Conference (ECTC '93) (1993)
Published in Proceedings of IEEE 43rd Electronic Components and Technology Conference (ECTC '93) (1993)
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Conference Proceeding
AlO bonding: a method of joining oxide optical components to aluminum coated substrates
Coucoulas, A., Benzoni, A.M., Dautartas, M.F., Dutta, R., Holland, W.R., Nijander, C.R., Woods, R.E.
Published in Proceedings of IEEE 43rd Electronic Components and Technology Conference (ECTC '93) (1993)
Published in Proceedings of IEEE 43rd Electronic Components and Technology Conference (ECTC '93) (1993)
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Conference Proceeding