Design method of a metallic enclosure considering EMI using a 3D-FEM
Tanabe, S., Nagano, N., Itoh, T., Murato, Y., Mizukawa, S., Sato, K.
Published in Proceedings of Electrical Performance of Electronic Packaging (1995)
Published in Proceedings of Electrical Performance of Electronic Packaging (1995)
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Conference Proceeding
Four-layered coplanar waveguide with double side conductor backings
Yaozhong Liu, Tatsuo Itoh
Published in Proceedings of Electrical Performance of Electronic Packaging (1995)
Published in Proceedings of Electrical Performance of Electronic Packaging (1995)
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Conference Proceeding
Microwave packages for 30 Gbit/s analog and digital circuits
Petersen, A.K., Yu, R., Runge, K., Bowers, J.E., Wang, K.C.
Published in Proceedings of Electrical Performance of Electronic Packaging (1995)
Published in Proceedings of Electrical Performance of Electronic Packaging (1995)
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Conference Proceeding
Leadless 432-pin package and solderless socket for a 622 MHz system
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Conference Proceeding
Effect of package shape on spurious coupling among microstrip discontinuities
Gupta, K.C., Cebi, H., Cheok Thng
Published in Proceedings of Electrical Performance of Electronic Packaging (1995)
Published in Proceedings of Electrical Performance of Electronic Packaging (1995)
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Conference Proceeding
Performance effects of switching noise on CMOS microprocessors
Becker, D., McCredie, B.D., Singh, B., Lin, P.
Published in Proceedings of Electrical Performance of Electronic Packaging (1995)
Published in Proceedings of Electrical Performance of Electronic Packaging (1995)
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Conference Proceeding
Multi-reflection algorithm for timed statistical coupled noise checking
Smith, H.H., Katopis, G., Hsu, M.
Published in Proceedings of Electrical Performance of Electronic Packaging (1995)
Published in Proceedings of Electrical Performance of Electronic Packaging (1995)
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Conference Proceeding
Modeling of simultaneous switching ground noise for BiCMOS drivers
Seeker, D.A., Prince, J.L.
Published in Proceedings of Electrical Performance of Electronic Packaging (1995)
Published in Proceedings of Electrical Performance of Electronic Packaging (1995)
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Conference Proceeding
A high performance MCM-D using Cu/fluoropolymer thin film multilayer technology
Jikuhara, R., Tanahashi, S.
Published in Proceedings of Electrical Performance of Electronic Packaging (1995)
Published in Proceedings of Electrical Performance of Electronic Packaging (1995)
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Conference Proceeding
Low cost, highly integrated MMW MMIC transceiver packages
Gawrouski, M., Seashore, C., Bosch, D., Lamberg, J., Loughran, S., Rabel, J.
Published in Proceedings of Electrical Performance of Electronic Packaging (1995)
Published in Proceedings of Electrical Performance of Electronic Packaging (1995)
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Conference Proceeding