An automatic network generator for design verification of electronic packages
Cherukuri, N., Prince, J.L.
Published in Proceedings of 1995 IEEE Multi-Chip Module Conference (MCMC-95) (1995)
Published in Proceedings of 1995 IEEE Multi-Chip Module Conference (MCMC-95) (1995)
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Conference Proceeding
Application of capacitive coupling to switch fabrics
Salzman, D., Knight, T., Franzon, P.
Published in Proceedings of 1995 IEEE Multi-Chip Module Conference (MCMC-95) (1995)
Published in Proceedings of 1995 IEEE Multi-Chip Module Conference (MCMC-95) (1995)
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Conference Proceeding
Micro heat spreader enhanced heat transfer in MCMs
Shen, D.S., Mitchell, R.T., Dobranich, D., Adkins, D.R., Tuck, M.R.
Published in Proceedings of 1995 IEEE Multi-Chip Module Conference (MCMC-95) (1995)
Published in Proceedings of 1995 IEEE Multi-Chip Module Conference (MCMC-95) (1995)
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Conference Proceeding
System design optimization for MCM
Franzon, P.D., Stanaski, A., Tekmen, Y., Banerjai, S.
Published in Proceedings of 1995 IEEE Multi-Chip Module Conference (MCMC-95) (1995)
Published in Proceedings of 1995 IEEE Multi-Chip Module Conference (MCMC-95) (1995)
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Conference Proceeding
Electrical and thermal study of membrane multi-chip module systems
Wheling Cheng, Wong, S.S.
Published in Proceedings of 1995 IEEE Multi-Chip Module Conference (MCMC-95) (1995)
Published in Proceedings of 1995 IEEE Multi-Chip Module Conference (MCMC-95) (1995)
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Conference Proceeding
Design of mixed signal MCM-Ds using silicon circuit boards
Hodges, C.R., Benson, D., Huey, K.
Published in Proceedings of 1995 IEEE Multi-Chip Module Conference (MCMC-95) (1995)
Published in Proceedings of 1995 IEEE Multi-Chip Module Conference (MCMC-95) (1995)
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Conference Proceeding
Cost effective small via generation-the laser solution
Bo Gu, Morrison, J.M.
Published in Proceedings of 1995 IEEE Multi-Chip Module Conference (MCMC-95) (1995)
Published in Proceedings of 1995 IEEE Multi-Chip Module Conference (MCMC-95) (1995)
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Conference Proceeding
A novel low cost MCM-D technology
Almeida, A.M., Barnett, M., Finardi, C.A., Flacker, A., Gozzi, A.C., Molina, J.P., Pagotto, A.C., Santos, M.F.
Published in Proceedings of 1995 IEEE Multi-Chip Module Conference (MCMC-95) (1995)
Published in Proceedings of 1995 IEEE Multi-Chip Module Conference (MCMC-95) (1995)
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Conference Proceeding
Two-pole analysis of interconnection trees
Kahng, A.B., Muddu, S.
Published in Proceedings of 1995 IEEE Multi-Chip Module Conference (MCMC-95) (1995)
Published in Proceedings of 1995 IEEE Multi-Chip Module Conference (MCMC-95) (1995)
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Conference Proceeding
Optimal transient simulation of distributed lines
Kuznetsov, D., Schutt-Aine, J.E., Mittra, R.
Published in Proceedings of 1995 IEEE Multi-Chip Module Conference (MCMC-95) (1995)
Published in Proceedings of 1995 IEEE Multi-Chip Module Conference (MCMC-95) (1995)
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Conference Proceeding
High temperature Cu-Sn joints manufactured by a 250/spl deg/C fluxless bonding process
Yi-Chia Chen, Lee, S.J., Lee, C.C.
Published in Proceedings of 1995 IEEE Multi-Chip Module Conference (MCMC-95) (1995)
Published in Proceedings of 1995 IEEE Multi-Chip Module Conference (MCMC-95) (1995)
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Conference Proceeding
Thermosonic bonding for flip-chip assembly
Sa Yoon Kang, McLaren, T., Wenge Zhang, Lee, Y.C.
Published in Proceedings of 1995 IEEE Multi-Chip Module Conference (MCMC-95) (1995)
Published in Proceedings of 1995 IEEE Multi-Chip Module Conference (MCMC-95) (1995)
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Conference Proceeding