Transcending the Reticle Limit in On-Wafer Die Integration and Advanced Packaging: Full-Wafer Patterning with High-Productivity Electron Beam Lithography
Byambadorj, Tsenguun, Ceballos, Andrew C., MacWilliams, Kenneth P., Prescop, Ted A., Lam, David K., Michalka, Timothy L., Bishop, Craig, Sandstrom, Cliff, Olson, Tim
Published in 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) (28.05.2024)
Published in 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) (28.05.2024)
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