Pandemic, War, and Global Energy Transitions
Zakeri, Behnam, Paulavets, Katsia, Barreto-Gomez, Leonardo, Echeverri, Luis Gomez, Pachauri, Shonali, Boza-Kiss, Benigna, Zimm, Caroline, Rogelj, Joeri, Creutzig, Felix, Ürge-Vorsatz, Diana, Victor, David G, Bazilian, Morgan D, Fritz, Steffen, Gielen, Dolf, McCollum, David L, Srivastava, Leena, Hunt, Julian D, Pouya, Shaheen
Published in Energies (Basel) (01.08.2022)
Published in Energies (Basel) (01.08.2022)
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Journal Article
Comparative Study of Decision Tree, AdaBoost, Random Forest, Naïve Bayes, KNN, and Perceptron for Heart Disease Prediction
Maydanchi, Mohammad, Ziaei, Armin, Basiri, Mina, Azad, Alireza Norouzi, Pouya, Shaheen, Ziaei, Mehrbod, Haji, Fatemeh, Sargolzaei, Saman
Published in SoutheastCon 2023 (01.04.2023)
Published in SoutheastCon 2023 (01.04.2023)
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Conference Proceeding
Examining the Mediating Effect of Knowledge Management on the Relationship Between Organizational Culture and Organizational Performance
Mohammadi, Mehrdad, Samizadeh, Mahrou, Pouya, Shaheen, Arabahmadi, Raheleh
Published in Journal of Soft Computing and Decision Analytics (28.08.2023)
Published in Journal of Soft Computing and Decision Analytics (28.08.2023)
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Journal Article
Evaluating Shear Properties of Individual Solder Joints in Ball Grid Arrays: The Impact of Silver (Ag) and Bismuth (Bi) Content
Tarman, Wa'ad, Alahmer, Ali, Bolanos, Sergio, Pouya, Shaheen, Alakayleh, Abdallah, El Amine Belhadi, Mohamed, Hamasha, Sa'd
Published in 2024 23rd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) (28.05.2024)
Published in 2024 23rd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) (28.05.2024)
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Conference Proceeding
Shear Strength Analysis of Aging SAC-Bi Solder Joints with Different Solder Paste Volumes
Pouya, Shaheen, Alahmer, Ali, Bolanos, Sergio, Tahat, Sufyan, Alalkayleh, Abdallah, El Amine Belhadi, Mohamed, Hamasha, Sa'd
Published in 2024 23rd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) (28.05.2024)
Published in 2024 23rd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) (28.05.2024)
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Conference Proceeding
The Effect of Bi Content and Strain Rate on Tensile Properties of SnAgCu-Bi Alloys
Bolanos, Sergio, Alahmer, Ali, Alakayleh, Abdallah, Pouya, Shaheen, Vyas, Palash Pranav, El Amine Belhadi, Mohamed, Hamasha, Sa'd
Published in 2024 23rd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) (28.05.2024)
Published in 2024 23rd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) (28.05.2024)
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Conference Proceeding
Drop Shock Test of PCB at Elevated Temperature
Vyas, Palash Pranav, Alahmer, Ali, Bolanos, Sergio, Pouya, Shaheen, Daradkeh, Saddam, El Amine Belhadi, Mohamed, Hamasha, Sa'd
Published in 2024 23rd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) (28.05.2024)
Published in 2024 23rd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) (28.05.2024)
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Conference Proceeding
Data Visualization of Traffic Violations in Maryland, U.S
Rababah, Mumen, Maydanchi, Mohammad, Pouya, Shaheen, Basiri, Mina, Azad, Alireza Norouzi, Haji, Fatemeh, Aminjarahi, Mohammad
Year of Publication 22.08.2022
Year of Publication 22.08.2022
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Journal Article