3-D Silicon Integration and Silicon Packaging Technology Using Silicon Through-Vias
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Published in IEEE journal of solid-state circuits (01.08.2006)
Published in IEEE journal of solid-state circuits (01.08.2006)
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Published in IBM journal of research and development (01.11.2008)
Published in IBM journal of research and development (01.11.2008)
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3D chip-stacking technology with through-silicon vias and low-volume lead-free interconnections
Sakuma, K, Andry, P S, Tsang, C K, Wright, S L, Dang, B, Patel, C S, Webb, B C, Maria, J, Sprogis, E J, Kang, S K, Polastre, R J, Horton, R R, Knickerbocker, J U
Published in IBM journal of research and development (01.11.2008)
Published in IBM journal of research and development (01.11.2008)
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Development of next-generation system-on-package (SOP) technology based on silicon carriers with fine-pitch chip interconnection
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Published in IBM journal of research and development (01.07.2005)
Published in IBM journal of research and development (01.07.2005)
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3D chip stacking with C4 technology
Dang, B, Wright, S L, Andry, P S, Sprogis, E J, Tsang, C K, Interrante, M J, Webb, B C, Polastre, R J, Horton, R R, Patel, C S, Sharma, A, Zheng, J, Sakuma, K, Knickerbocker, J U
Published in IBM journal of research and development (01.11.2008)
Published in IBM journal of research and development (01.11.2008)
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A Practical Implementation of Silicon Microchannel Coolers for High Power Chips
Colgan, E.G., Furman, B., Gaynes, M., Graham, W.S., LaBianca, N.C., Magerlein, J.H., Polastre, R.J., Rothwell, M.B., Bezama, R.J., Choudhary, R., Marston, K.C., Toy, H., Wakil, J., Zitz, J.A., Schmidt, R.R.
Published in IEEE transactions on components and packaging technologies (01.06.2007)
Published in IEEE transactions on components and packaging technologies (01.06.2007)
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Low-profile battery construct with engineered interfaces
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Year of Publication 23.11.2021
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Year of Publication 23.11.2021
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Liquid crystal lens with variable focal length
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Year of Publication 23.10.2018
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Year of Publication 23.10.2018
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Liquid crystal lens with variable focal length
Gordon, Michael S, Knickerbocker, John U, Polastre, Robert, Lu, Minhua
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Liquid Crystal Lens With Variable Focal Length
Gordon, Michael S, Knickerbocker, John U, Polastre, Robert, Lu, Minhua
Year of Publication 19.04.2018
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Method of forming a plurality of electro-optical module assemblies
Dang, Bing, Polastre, Robert J, Knickerbocker, John U, Chen, Qianwen, Webb, Bucknell C, Andry, Paul S, Lu, Minhua
Year of Publication 16.06.2020
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Year of Publication 16.06.2020
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Integrated electro-optical module assembly
Dang, Bing, Polastre, Robert J, Knickerbocker, John U, Chen, Qianwen, Webb, Bucknell C, Andry, Paul S, Lu, Minhua
Year of Publication 02.06.2020
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Year of Publication 02.06.2020
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LOW-PROFILE BATTERY CONSTRUCT WITH ENGINEERED INTERFACES
Narasgond, Adinath, Nah, Jae-Woong, Polastre, Robert J, Lauro, Paul A, Webb, Bucknell C, Andry, Paul S
Year of Publication 07.05.2020
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Year of Publication 07.05.2020
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Method of forming a plurality of electro-optical module assemblies
Dang, Bing, Polastre, Robert J, Knickerbocker, John U, Chen, Qianwen, Webb, Bucknell C, Andry, Paul S, Lu, Minhua
Year of Publication 28.04.2020
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Year of Publication 28.04.2020
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CMOS compatible thin wafer processing using temporary mechanical wafer, adhesive and laser release of thin chips/wafers for 3D integration
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Published in 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC) (01.06.2010)
Published in 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC) (01.06.2010)
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Conference Proceeding
Integration and Packaging of Embedded Radial Micro-Channels for 3D Chip Cooling
Bing Dang, Colgan, Evan, Fanghao Yang, Schultz, Mark, Yang Liu, Qianwen Chen, Jae-Woong Nah, Polastre, Robert, Gaynes, Michael, McVicker, Gerard, Parida, Pritish, Tsang, Cornelia, Knickerbocker, John, Chainer, Timothy
Published in 2016 IEEE 66th Electronic Components and Technology Conference (ECTC) (01.05.2016)
Published in 2016 IEEE 66th Electronic Components and Technology Conference (ECTC) (01.05.2016)
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Conference Proceeding