Extraction of a lumped element, equivalent circuit model for via interconnections in 3-D packages using a single via structure with embedded capacitors
Poh, Chung Hang John, Bhattacharya, Swapan K, Ferguson, Jason, Cressler, John D, Papapolymerou, John
Published in 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC) (01.06.2010)
Published in 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC) (01.06.2010)
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Conference Proceeding
Packaging Effects of Multiple X-Band SiGe LNAs Embedded in an Organic LCP Substrate
Poh, Chung Hang John, Patterson, C. E., Bhattacharya, S. K., Philips, S. D., Lourenco, N. E., Cressler, J. D., Papapolymerou, J.
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.08.2012)
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.08.2012)
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Journal Article
Using saturated SiGe HBTs to realize ultra-low voltage/power X-band low noise amplifiers
Seth, S., Poh, C. H. J., Thrivikraman, T., Arora, R., Cressler, J. D.
Published in 2011 IEEE Bipolar/BiCMOS Circuits and Technology Meeting (01.10.2011)
Published in 2011 IEEE Bipolar/BiCMOS Circuits and Technology Meeting (01.10.2011)
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Conference Proceeding
Impact of Source/Drain contact and gate finger spacing on the RF reliability of 45-nm RF nMOSFETs
Arora, R, Seth, S, Poh, J C H, Cressler, J D, Sutton, A K, Nayfeh, H M, Rosa, G L, Freeman, G
Published in 2011 International Reliability Physics Symposium (01.04.2011)
Published in 2011 International Reliability Physics Symposium (01.04.2011)
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Conference Proceeding
An X-band to Ka-band SPDT switch using 200 nm SiGe HBTs
Poh, Chung Hang John, Schmid, R. L., Cressler, J. D., Papapolymerou, J.
Published in 2012 IEEE 12th Topical Meeting on Silicon Monolithic Integrated Circuits in RF Systems (01.01.2012)
Published in 2012 IEEE 12th Topical Meeting on Silicon Monolithic Integrated Circuits in RF Systems (01.01.2012)
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Conference Proceeding
A systematic measurement technique to characterize bimodal oscillation for CMOS Quadrature LC-VCO
Shih-Chieh Shin, Sen-Wen Hsiao, Poh, John Chung-Hang, Laskar, J
Published in 2010 Asia-Pacific Microwave Conference (01.12.2010)
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Published in 2010 Asia-Pacific Microwave Conference (01.12.2010)
Conference Proceeding
High gain, high linearity, L-band SiGe low noise amplifier with fully-integrated matching network
Poh, J.C.H., Peng Cheng, Thrivikraman, T.K., Cressler, J.D.
Published in 2010 Topical Meeting on Silicon Monolithic Integrated Circuits in RF Systems (SiRF) (01.01.2010)
Published in 2010 Topical Meeting on Silicon Monolithic Integrated Circuits in RF Systems (SiRF) (01.01.2010)
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Conference Proceeding
Organic wafer-scale packaging for X-band SiGe low noise amplifier
Patterson, Chad E., Thrivikraman, Tushar K., Bhattacharya, Swapan K., Poh, Chung Hang John, Cressler, John D., Papapolymerou, John
Published in 2009 European Microwave Conference (EuMC) (01.09.2009)
Published in 2009 European Microwave Conference (EuMC) (01.09.2009)
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Conference Proceeding
An LCP package model for use in chip/package co-design of an X-band SiGe Low Noise Amplifier
Poh, C.H.J., Thrivikraman, T.K., Bhattacharya, S.K., Patterson, C.E., Cressler, J.D., Papapolymerou, J.
Published in 2009 IEEE 18th Conference on Electrical Performance of Electronic Packaging and Systems (01.10.2009)
Published in 2009 IEEE 18th Conference on Electrical Performance of Electronic Packaging and Systems (01.10.2009)
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Conference Proceeding