Effects of single vacancy defect position on the stability of carbon nanotubes
Poelma, R.H., Sadeghian, H., Koh, S., Zhang, G.Q.
Published in Microelectronics and reliability (01.07.2012)
Published in Microelectronics and reliability (01.07.2012)
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Journal Article
Conference Proceeding
Multi-LED package design, fabrication and thermal analysis
Poelma, R. H., Tarashioon, S., van Zeijl, H. W., Goldbach, S., Zijl, J. L. J., Zhang, G. Q.
Published in Journal of semiconductors (01.05.2013)
Published in Journal of semiconductors (01.05.2013)
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Journal Article
Mechanical characterization of individual polycrystalline carbon tubes for use in electrical nano-interconnects
Khiat, A., Poelma, R.H., Zhang, G.Q., Heuck, F., Tichelaar, F.D., Sarno, M., Ciambelli, P., Fontorbes, S., Arurault, L., Staufer, U.
Published in Microelectronic engineering (01.10.2012)
Published in Microelectronic engineering (01.10.2012)
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Journal Article
Conference Proceeding
Microstructure Analysis Based on 3D reconstruction Model and Transient Thermal Impedance Measurement of Resin-reinforced Sintered Ag layer for High power RF device
Hu, X., Martina, H.A., Poelma, R.H., Huang, J.L., Rijckevorsel, H., Scholten, H., Smits, E.C.P., Van Driel, W.D., Zhang, G.Q.
Published in 2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) (17.04.2023)
Published in 2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) (17.04.2023)
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Conference Proceeding
Light transmittance in human atrial tissue and transthoracic illumination in rats support translatability of optogenetic cardioversion of AF
Portero, V, Nyns, E C A, Harlaar, N, Deng, S, Tianyi, T, Bart, C I, Van Brakel, T J, Palmen, M, Hjortnaes, J, Ramkisoensing, A A, Zhang, G Q, Poelma, R H, Ordog, B, De Vries, A A F, Pijnappels, D A
Published in European heart journal (09.11.2023)
Published in European heart journal (09.11.2023)
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Journal Article
Metallic Nanoparticle Based Interconnect for Heterogeneous 3D Integration
van Zeijl, H. W., Carisey, Y., Damian, A., Poelma, R. H., Zinn, A., Zhang, C. Q.
Published in 2016 IEEE 66th Electronic Components and Technology Conference (ECTC) (01.05.2016)
Published in 2016 IEEE 66th Electronic Components and Technology Conference (ECTC) (01.05.2016)
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Conference Proceeding
2160Continuous shock-free termination of atrial fibrillation by local optogenetic therapy and arrhythmia-triggered activation of an implanted light source
Nyns, E C A, Poelma, R H, Volkers, L, Bart, C I, Van Brakel, T J, Zeppenfeld, K, Schalij, M J, Zhang, G Q, De Vries, A A F, Pijnappels, D A
Published in European heart journal (01.10.2019)
Published in European heart journal (01.10.2019)
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Journal Article
Tailoring material properties for 3D microfabrication: In-situ experimentation and multi-scale modelling
Poelma, R. H., Fan, X. J., Schlangen, E., van Zeijl, H. W., Zhang, G. Q.
Published in 2016 17th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) (01.04.2016)
Published in 2016 17th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) (01.04.2016)
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Conference Proceeding
Buckling analysis of carbon nanotubes and the influence of defect position
Poelma, R H, Sadeghian, H, Koh, Sau, Zhang, G Q
Published in 2011 12th Intl. Conf. on Thermal, Mechanical & Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (01.04.2011)
Published in 2011 12th Intl. Conf. on Thermal, Mechanical & Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (01.04.2011)
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Conference Proceeding
High aspect ratio spiral resonators for process variation investigation and MEMS applications
Middelburg, L.M., El Mansouri, B., van Zeijl, H.W., Zhang, G.Q., Poelma, R.H.
Published in 2017 IEEE SENSORS (01.10.2017)
Published in 2017 IEEE SENSORS (01.10.2017)
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Conference Proceeding
Molecular Dynamics study of the traction-displacement relations of epoxy-copper interfaces
Wong, C K Y, Leung, S Y Y, Poelma, R H, Jansen, K M B, Yuan, C C A, van Driel, W D, Zhang, G Q
Published in 2011 12th Intl. Conf. on Thermal, Mechanical & Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (01.04.2011)
Published in 2011 12th Intl. Conf. on Thermal, Mechanical & Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (01.04.2011)
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Conference Proceeding
Multi-scale numerical-experimental method to determine the size dependent elastic properties of bilayer silicon copper nanocantilevers using an electrostatic pull in experiment
Poelma, R H, Sadeghian, H, Noijen, S P M, Zaal, J J M, Zhang, G Q
Published in 2010 11th International Thermal, Mechanical & Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems (EuroSimE) (01.04.2010)
Published in 2010 11th International Thermal, Mechanical & Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems (EuroSimE) (01.04.2010)
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Conference Proceeding
Through-polymer-via for 3D heterogeneous integration and packaging
Hamelink, J., Poelma, R. H., Kengen, M.
Published in 2015 IEEE 17th Electronics Packaging and Technology Conference (EPTC) (01.12.2015)
Published in 2015 IEEE 17th Electronics Packaging and Technology Conference (EPTC) (01.12.2015)
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Conference Proceeding
Wafer Level Through Polymer Optical Vias (TPOV) Enabling High Throughput of Optical Windows Manufacturing
HUANG, Z.Q., Poelma, R.H., Vollebregt, S., Koelink, M.H., Boschman, E., Kropf, R., Gallouch, M., Zhang, G.Q.
Published in 2018 7th Electronic System-Integration Technology Conference (ESTC) (01.09.2018)
Published in 2018 7th Electronic System-Integration Technology Conference (ESTC) (01.09.2018)
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Conference Proceeding
3D interconnect technology based on low temperature copper nanoparticle sintering
Zhang, B., Carisey, Y. C. P., Damian, A., Poelma, R. H., Zhang, G. Q., van Zeijl, H. W.
Published in 2016 17th International Conference on Electronic Packaging Technology (ICEPT) (01.08.2016)
Published in 2016 17th International Conference on Electronic Packaging Technology (ICEPT) (01.08.2016)
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Conference Proceeding
Designing a 100 [aF/nm] capacitive transducer
Middelburg, L. M., Mansouri, B. El, Poelma, R. H., van Zeijl, H. W., Wei, J., Zhang, G. Q., van Driel, W. D.
Published in 2018 19th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) (01.04.2018)
Published in 2018 19th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) (01.04.2018)
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Conference Proceeding
Low temperature hybrid wafer bonding for 3D integration
Damian, A. A., Poelma, R. H., van Zeijl, H. W., Zhang, G. Q.
Published in 2013 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) (01.04.2013)
Published in 2013 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) (01.04.2013)
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Conference Proceeding
Transfer molding of primary LED optics; High aspect ratio domes
Kersjes, S. H. M., Zijl, J. L. J., Poelma, R. H., Wensink, H. W.
Published in 2013 Eurpoean Microelectronics Packaging Conference (EMPC) (01.09.2013)
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Published in 2013 Eurpoean Microelectronics Packaging Conference (EMPC) (01.09.2013)
Conference Proceeding