Search Results - "Poay Chuah, Tin" :: K.UTB vyhledávací portál

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VIA PLUG RESISTOR

by Chuah, Tin Poay, Gangal, Santosh
Year of Publication 22.09.2022

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Patent

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VIA PLUG CAPACITOR

by Chuah, Tin Poay, Gangal, Santosh
Year of Publication 22.09.2022

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Patent

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ON-PACKAGE EMBEDDED COOLING DEVICE

by Chuah, Tin Poay, Lee, Eng Kwong, Lim, Chew Ching
Year of Publication 03.10.2024

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Patent

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WRAPAROUND FOLDABLE DISPLAY WITH TRIANGULAR 3D PCB SYSTEM

by Chuah, Tin Poay, LOO, Howe Yin, Lim, Yew San
Year of Publication 09.04.2024

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Patent

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A SYSTEM HAVING A FIRST PCB AND A SECOND PCB THAT COMPRISES AN ELECTROMAGNETIC INTERFERENCE SHIELD AND SIGNAL ROUTING FOR THE FIRST PCB

by LIM, Min Suet, CHUAH, Tin Poay, GOH, Eng Huat
Year of Publication 09.02.2024

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Patent

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Embedded package in PCB build up

by Chuah, Tin Poay
Year of Publication 19.02.2019

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Patent

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Three dimensional foldable substrate with vertical side interface

by Chuah, Tin Poay, Cheah, Bok Eng, Kong, Jackson Chung Peng
Year of Publication 12.09.2023

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Patent

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Method of forming a capacitive loop substrate assembly

by Chuah, Tin Poay, Ong, Jenny Shio Yin, Kuan, Chin Lee
Year of Publication 06.12.2022

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Patent

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THREE DIMENSIONAL FOLDABLE SUBSTRATE WITH VERTICAL SIDE INTERFACE

by Chuah, Tin Poay, Cheah, Bok Eng, Kong, Jackson Chung Peng
Year of Publication 17.11.2022

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Patent

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Electronic device and crosstalk mitigating substrate

by Chuah, Tin Poay, Cheah, Bok Eng, Kong, Jackson Chung Peng, Lim, Min Suet
Year of Publication 09.07.2024

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Patent

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LAPTOP ARRANGEMENT FOR HEAT CONTROL

by GOH, Chin Kung, CHEE, Jiunn Shyong, CHUAH, Tin Poay, LIM, Yew San, LOO, Howe Yin
Year of Publication 02.05.2024

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Patent

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ELECTRONIC DEVICE AND CROSSTALK MITIGATING SUBSTRATE

by CHEAH, Bok Eng, LIM, Min Suet, Chuah, Tin Poay, KONG, Jackson Chung Peng
Year of Publication 17.04.2024

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Patent

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CAPACITOR LOOP STRUCTURE

by Tin Poay Chuah, Chin Lee Kuan, Jenny Shio Yin Ong
Year of Publication 14.07.2022

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Patent

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Interposer with flexible portion

by Chuah, Tin Poay, Cheah, Bok Eng, Kong, Jackson Chung Peng, Lim, Min Suet
Year of Publication 26.03.2024

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Patent

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Three dimensional foldable substrate with vertical side interface

by Chuah, Tin Poay, Cheah, Bok Eng, Kong, Jackson Chung Peng
Year of Publication 28.06.2022

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Patent

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Device, method and system for providing recessed interconnect structures of a substrate

by Loo, Howe Yin, Chuah, Tin Poay, Sharan, Sujit, Prabhakumar, Ananth
Year of Publication 07.06.2022

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Patent

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DIE-STACKED AND MOLDED ARCHITECTURE FOR MEMORY ON PACKAGE (MOP)

by Chuah, Tin Poay, Lim, Seok Ling, Ong, Jenny Shio Yin, Lee, Chan Kim, Goh, Eng Huat
Year of Publication 04.01.2024

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Patent

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PACKAGE WITH EMBEDDED CAPACITORS

by ONG, Jenny Shio Yin, CHUAH, Tin Poay, CHEW, Hon Wah, LIM, Seok Ling
Year of Publication 21.12.2023

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Patent

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SUBSTRATE TO BOARD INTERCONNECT WITH LIQUID METAL AND SURFACE PINS

by Ku, Jeff, Chuah, Tin Poay, Loo, Twan Sing, Lim, Min Suet, Lim, Yew San
Year of Publication 07.12.2023

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Patent

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Expandable thermal solution for laptops

by Ku, Jeff, Chuah, Tin Poay, Loo, Howe Yin, Nien, Cora Shih Wei, Goh, Chin Kung, Lim, Yew San
Year of Publication 13.08.2024

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Patent

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