GaAs wafer bonding by atomic hydrogen surface cleaning
Akatsu, Takeshi, Plößl, Andreas, Stenzel, Heinz, Gösele, Ulrich
Published in Journal of applied physics (15.12.1999)
Published in Journal of applied physics (15.12.1999)
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Journal Article
Wafer direct bonding: tailoring adhesion between brittle materials
Plößl, Andreas, Kräuter, Gertrud
Published in Materials science & engineering. R, Reports : a review journal (10.03.1999)
Published in Materials science & engineering. R, Reports : a review journal (10.03.1999)
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Journal Article