Scalable Advanced DBHi Chiplet Package Using Silicon Bridge With 30 µm-Pitch Solder Joints
Horibe, Akihiro, Watanabe, Takahito, Marushima, Chinami, Kohara, Sayuri, Yamada, Yasuharu, Mori, Hiroyuki, Taneja, Divya, Pilger, Katherine, Jacques-Fortin, Alexis, Godard, Maxime, Chen, Qianwen, Perfecto, Eric, Jain, Aakrati, Ross, Joseph R, Wassick, Thomas, De Sousa, Isabel
Published in 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) (28.05.2024)
Published in 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) (28.05.2024)
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