Linking Activity to Information and Energy in Hardware
Zeigler, Bernard P., Kim, Doohwon, Seo, Chungman, Pifer, Tim, Lysecky, Roman
Published in ITM Web of Conferences (2013)
Published in ITM Web of Conferences (2013)
Get full text
Journal Article
Conference Proceeding
Cu concentration from backside contamination induced STI crack after High Temperature Stress
Jim Lee, Hsiang, J. Huang, Gunnar, Zimmermann, Alexander, Ambatiello, Xu, X. Wang, Tim, J. Pifer
Published in 2015 IEEE 22nd International Symposium on the Physical and Failure Analysis of Integrated Circuits (01.06.2015)
Published in 2015 IEEE 22nd International Symposium on the Physical and Failure Analysis of Integrated Circuits (01.06.2015)
Get full text
Conference Proceeding