Defect-Free Dicing for Higher Device Reliability
Johnston, Christopher, Piallat, Fabien
Published in 2018 7th Electronic System-Integration Technology Conference (ESTC) (01.09.2018)
Published in 2018 7th Electronic System-Integration Technology Conference (ESTC) (01.09.2018)
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Conference Proceeding
Interface and plasma damage analysis of PEALD TaCN deposited on HfO2 for advanced CMOS studied by angle resolved XPS and C-V
PIALLAT, Fabien, BEUGIN, Virginie, GASSILLOUD, Remy, DUSSAULT, Laurent, PELISSIER, Bernard, LEROUX, Charles, CAUBET, Pierre, VALLEE, Christophe
Published in Applied surface science (01.06.2014)
Published in Applied surface science (01.06.2014)
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Journal Article
Study of low temperature MOCVD deposition of TiN barrier layer for copper diffusion in high aspect ratio through silicon vias
Djomeni, Larissa, Mourier, Thierry, Minoret, Stéphane, Fadloun, Sabrina, Piallat, Fabien, Burgess, Steve, Price, Andrew, Zhou, Yun, Jones, Christopher, Mathiot, Daniel, Maitrejean, Sylvain
Published in Microelectronic engineering (25.05.2014)
Published in Microelectronic engineering (25.05.2014)
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Journal Article
Conference Proceeding
PECVD, RF vs Dual Frequency: investigation of plasma influence on metalorganic precursors decomposition and material characteristics
Piallat, Fabien, Vallée, Christophe, Gassilloud, Rémy, Michallon, Philippe, Pélissier, Bernard, Caubet, Pierre
Published in Journal of physics. D, Applied physics (2014)
Published in Journal of physics. D, Applied physics (2014)
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Journal Article
Evaluation of plasma parameters on PEALD deposited TaCN
Piallat, Fabien, Beugin, Virginie, Gassilloud, Remy, Michallon, Philippe, Dussault, Laurent, Pelissier, Bernard, Asikainen, Timo, Maes, Jan Willem, Martin, François, Morin, Pierre, Vallée, Christophe
Published in Microelectronic engineering (01.07.2013)
Published in Microelectronic engineering (01.07.2013)
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Journal Article
Conference Proceeding
Alternative Deposition Solution for Cost Reduction of TSV Integration
Vitiello, Julien, Piallat, Fabien
Published in 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) (01.05.2018)
Published in 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) (01.05.2018)
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Conference Proceeding