Analysis of lattice deformation originated from residual stress on performance of aluminum nitride-based bulk acoustic wave resonators
Gu, Xiyu, Liu, Yan, Qu, Yuanhang, Wei, Min, Chen, Xiang, Wang, Yaxin, Liu, Wenjuan, Pi, Bensong, Woon Soon, Bo, Cai, Yao, Guo, Shishang, Sun, Chengliang
Published in Composite structures (15.07.2024)
Published in Composite structures (15.07.2024)
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Journal Article
Analysis the interface delamination of Cu and EMC adhesive material in the cutting process of electronic chip based on cohesive zone modeling
Yu Huiping, Hu Mingqing, Qin Fei, An Tong, Chen Pei, Pi Bensong
Published in 2016 17th International Conference on Electronic Packaging Technology (ICEPT) (01.08.2016)
Published in 2016 17th International Conference on Electronic Packaging Technology (ICEPT) (01.08.2016)
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Conference Proceeding
Thermal conductivity of epoxy resin using molecular dynamics simulation
PI, Bensong, YU, Huiping, QIN, Fei, CHEN, Pei, CAI, Anwen
Published in 2018 19th International Conference on Electronic Packaging Technology (ICEPT) (01.08.2018)
Published in 2018 19th International Conference on Electronic Packaging Technology (ICEPT) (01.08.2018)
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Conference Proceeding
Filter and preparation method thereof
XIAO LIYAN, SUN CHENGLIANG, SUN BOWEN, ZHOU JIE, PI BENSONG, CHEN BANGTAO
Year of Publication 28.06.2024
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Year of Publication 28.06.2024
Patent
Bulk acoustic wave resonator and filter
ZHAO CHAO, SUN CHENGLIANG, REN QIN, WANG YU, GUO SHISHANG, PI BENSONG, LIN BINGHUI, ZHAO KUNLI, QU YUANHANG, LIU DEYONG
Year of Publication 09.07.2024
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Year of Publication 09.07.2024
Patent
Resonator and filter
ZHAO CHAO, SUN CHENGLIANG, SUN BOWEN, WANG YU, REN QIN, PI BENSONG, GUAN RUOFEI, LIN BINGHUI, ZHAO KUNLI
Year of Publication 09.07.2024
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Year of Publication 09.07.2024
Patent
Film bulk acoustic resonator and preparation method thereof
ZHAO CHAO, SUN CHENGLIANG, SUN BOWEN, LI XIKE, WANG YU, REN QIN, PI BENSONG, ZHAO KUNLI, LIN BINGHUI
Year of Publication 02.01.2024
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Year of Publication 02.01.2024
Patent
Bulk acoustic wave resonance assembly and preparation method thereof
TENG HEXIN, ZHAO CHAO, WANG JIAN, SUN CHENGLIANG, CAMPANELLA-PINEDA HUMBERTO, LEE TAE-HEE, SUN BOWEN, ZHOU YAPING, WANG XIAOPING, DAI JINHAO, PI BENSONG, ZHAO KUNLI
Year of Publication 08.12.2023
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Year of Publication 08.12.2023
Patent