Cyanate Ester-Based Encapsulation Material for High-Temperature Applications
Chidambaram, Vivek, Rong, Eric Phua Jian, Lip, Gan Chee, Daniel, Rhee Min Woo
Published in Journal of electronic materials (01.09.2013)
Published in Journal of electronic materials (01.09.2013)
Get full text
Journal Article
Pb-Free Glass Paste: A Metallization-Free Die-Attachment Solution for High-Temperature Application on Ceramic Substrates
Sharif, Ahmed, Lim, Jun zhang, Made, Riko I, Lau, Fu Long, Phua, Eric Jian Rong, Lim, Ju Dy, Wong, Chee Cheong, Gan, Chee Lip, Chen, Zhong
Published in Journal of electronic materials (01.08.2013)
Published in Journal of electronic materials (01.08.2013)
Get full text
Journal Article
Novel high temperature polymeric encapsulation material for extreme environment electronics packaging
Phua, Eric Jian Rong, Liu, Ming, Cho, Bokun, Liu, Qing, Amini, Shahrouz, Hu, Xiao, Gan, Chee Lip
Published in Materials & design (05.03.2018)
Published in Materials & design (05.03.2018)
Get full text
Journal Article
A low-profile three-dimensional neural probe array using a silicon lead transfer structure
Cheng, Ming-Yuan, Je, Minkyu, Tan, Kwan Ling, Tan, Ee Lim, Lim, Ruiqi, Yao, Lei, Li, Peng, Park, Woo-Tae, Phua, Eric Jian Rong, Gan, Chee Lip, Yu, Aibin
Published in Journal of micromechanics and microengineering (01.09.2013)
Published in Journal of micromechanics and microengineering (01.09.2013)
Get full text
Journal Article
Study on silver sintered die attach material with different metal surfaces for high temperature and high pressure (300°c/30kpsi) applications
Leong Ching Wai, Wen Wei Seit, Rong, Eric Phua Jian, Mian Zhi Ding, Rao, Vempati Srinivasa, MinWoo, Daniel Rhee
Published in 2013 IEEE 15th Electronics Packaging Technology Conference (EPTC 2013) (01.12.2013)
Published in 2013 IEEE 15th Electronics Packaging Technology Conference (EPTC 2013) (01.12.2013)
Get full text
Conference Proceeding
Extreme high pressure and high temperature package development
Hwang How Yuan, Ching, Eva Wai Leong, Chan Yuen Sing, Chidambaram, Vivek, Lee Jong Bum, Rong, Eric Phua Jian, Gan Chee Lip, Woo, Daniel Rhee Min
Published in 2013 IEEE 15th Electronics Packaging Technology Conference (EPTC 2013) (01.12.2013)
Published in 2013 IEEE 15th Electronics Packaging Technology Conference (EPTC 2013) (01.12.2013)
Get full text
Conference Proceeding
Behavior of Resorcinol based Phthalonitrile as High Temperature Encapsulant
Tay, Yu Shan, Phua, Jian Rong Eric, Gan, Chee Lip
Published in 2019 IEEE 21st Electronics Packaging Technology Conference (EPTC) (01.12.2019)
Published in 2019 IEEE 21st Electronics Packaging Technology Conference (EPTC) (01.12.2019)
Get full text
Conference Proceeding
Phthalonitrile-Based Electronic Packages for High Temperature Applications
PHUA, Eric Jian Rong, LIU, Ming, LIM, Jacob Song Kit, CHO, Bokun, GAN, Chee Lip
Published in 2018 IEEE 20th Electronics Packaging Technology Conference (EPTC) (01.12.2018)
Published in 2018 IEEE 20th Electronics Packaging Technology Conference (EPTC) (01.12.2018)
Get full text
Conference Proceeding
A halogen-free epoxy with intrinsic flame retardance for use in electronic packaging
Lim, Song Kiat Jacob, Phua, Jian Rong Eric, Bai, Yu, Hu, Xiao, Gan, Chee Lip
Published in 2016 IEEE 18th Electronics Packaging Technology Conference (EPTC) (01.11.2016)
Published in 2016 IEEE 18th Electronics Packaging Technology Conference (EPTC) (01.11.2016)
Get full text
Conference Proceeding
Development of ruggedized timer and temperature sensor packaging for 300°C/30kpsi downhole environment
Hwang How Yuan, Kuruveettil, Haridas, Ching, Eva Wai Leong, Rong, Eric Phua Jian, Lip, Gan Chee, Woo, Daniel Rhee Min
Published in 2014 IEEE 16th Electronics Packaging Technology Conference (EPTC) (01.12.2014)
Published in 2014 IEEE 16th Electronics Packaging Technology Conference (EPTC) (01.12.2014)
Get full text
Conference Proceeding
Transient liquid phase (TLP) bonding using Sn/Ag multilayers for high temperature applications
Nobeen, Nadeesh Singh, Imade, Riko, Byung Roon Lee, Rong Phua, Eric Jian, Chee Cheong Wong, Chee Lip Gan, Zhong Chen
Published in 2013 IEEE 15th Electronics Packaging Technology Conference (EPTC 2013) (01.12.2013)
Published in 2013 IEEE 15th Electronics Packaging Technology Conference (EPTC 2013) (01.12.2013)
Get full text
Conference Proceeding
Electronic packages for high pressure applications: A dome-shaped cavity design
Rong, Eric Phua Jian, Riko, I. Made, Sharif, Ahmed, Wong Chee Cheong, Zhong, Chen, MinWoo, Daniel Rhee, Gan Chee Lip
Published in 2013 IEEE 63rd Electronic Components and Technology Conference (01.05.2013)
Published in 2013 IEEE 63rd Electronic Components and Technology Conference (01.05.2013)
Get full text
Conference Proceeding
Ceramic - Ceramic joining using glass frit for high temperature application
Lim Jun Zhang, Sharif, A., Ho Beng Yeung, Rong, E. P. J., Riko, I. M., Lau Fu Long, Lim Ju Dy, Wong Chee Cheong
Published in 2012 IEEE 14th Electronics Packaging Technology Conference (EPTC) (01.12.2012)
Published in 2012 IEEE 14th Electronics Packaging Technology Conference (EPTC) (01.12.2012)
Get full text
Conference Proceeding
Study of thin film metallization adhesion in ceramic multichip module
Lim Ju Dy, Rong, E. P. J., Riko, I. M., Sharif, A., Lim Jun Zhang, Lau Fu Long, Gan Chee Lip, Chen Zhong, MinWoo, D. R., Wong Chee Cheong
Published in 2012 IEEE 14th Electronics Packaging Technology Conference (EPTC) (01.12.2012)
Published in 2012 IEEE 14th Electronics Packaging Technology Conference (EPTC) (01.12.2012)
Get full text
Conference Proceeding
Study of metal additives to alumina substrate for high temperature and pressure application
Riko, I. M., Pramana, S. S., Rong, E. P. J., Wong Chee Cheong, Chen Zhong, Yoong, A. T. I., Lip, G. C.
Published in 2012 IEEE 14th Electronics Packaging Technology Conference (EPTC) (01.12.2012)
Published in 2012 IEEE 14th Electronics Packaging Technology Conference (EPTC) (01.12.2012)
Get full text
Conference Proceeding
Study of electrical property of Au-Ge eutectic solder alloys for high temperature electronics
Lau Fu Long, Riko, I. M., Putra, W. N., Rong, E. P. J., Lim Jun Zhang, Lim Ju Dy, Wong Chee Cheong, Chen Zhong, Nachiappan, V. C., Lip, G. C.
Published in 2012 IEEE 14th Electronics Packaging Technology Conference (EPTC) (01.12.2012)
Published in 2012 IEEE 14th Electronics Packaging Technology Conference (EPTC) (01.12.2012)
Get full text
Conference Proceeding