Mechanical Response of Type 2 Multi-Layer Ceramic Capacitors Under Different Electric Loads
Coanda, Philip, Moise, Madalin Vasile, Comeaga, Daniel-Constantin, Svasta, Paul Mugur
Published in 2023 IEEE 29th International Symposium for Design and Technology in Electronic Packaging (SIITME) (18.10.2023)
Published in 2023 IEEE 29th International Symposium for Design and Technology in Electronic Packaging (SIITME) (18.10.2023)
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Conference Proceeding
TIE-M Plus: Promoting Structural Analysis Learning with Competition
Tinca, Iulia-Eliza, Coanda, Philip, Krausz, Tamas, Ailinei, Iulian-Ionut, Verzes, Ionut-Daniel, Popescu, Constantin, Botau, Aurelian, Svasta, Paul-Mugur
Published in 2023 IEEE 29th International Symposium for Design and Technology in Electronic Packaging (SIITME) (18.10.2023)
Published in 2023 IEEE 29th International Symposium for Design and Technology in Electronic Packaging (SIITME) (18.10.2023)
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Conference Proceeding
TIE-M - Promoting Learning with Competition
Coanda, Philip, Moise, Madalin Vasile, Svasta, Paul Mugur, Comeaga, Daniel Constantin, Moisa, Cosmin
Published in 2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC) (13.09.2022)
Published in 2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC) (13.09.2022)
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Conference Proceeding
Design, fabrication, and testing of a high-load, low-cost thermal chamber
Coanda, Philip, Avram, Mihai, Comeaga, Daniel, Gramescu, Bogdan, Constantin, Victor, Emil, Nita
Published in 2022 8th International Conference on Energy Efficiency and Agricultural Engineering (EE&AE) (30.06.2022)
Published in 2022 8th International Conference on Energy Efficiency and Agricultural Engineering (EE&AE) (30.06.2022)
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Conference Proceeding