Low cycle fatigue of thin aluminium and copper layers and their susceptibility to corrosion
Sebastian, Breitenreiner, Nadine, Pflugler, Reinhard, Pufall, Bernhard, Wunderle
Published in 2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC) (13.09.2022)
Published in 2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC) (13.09.2022)
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Conference Proceeding
Design of robust packages by deliberate release of elastic energy to avoid interfacial crack propagation
Pufall, Reinhard, Goroll, Michael, Reuther, Georg M., Pflugler, Nadine, Udiljak, Dominik, Dudek, Rainer
Published in 2018 19th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) (01.04.2018)
Published in 2018 19th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) (01.04.2018)
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Conference Proceeding
Low Cycle Fatigue of Thin Metal Films on Vibrating Silicon MEMS Cantilevers: Finite Element Modelling Facilitating Experimental Design
Pflugler, Nadine, Breitenreiner, Sebastian, Pufall, Reinhard, Wunderle, Bernhard
Published in 2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) (25.04.2022)
Published in 2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) (25.04.2022)
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Conference Proceeding
Advanced risk analysis of interface delamination in semiconductor packages: A novel experimental approach to calibrating cohesive zone elements for finite element modelling
Pflugler, Nadine, Reuther, Georg M., Goroll, Michael, Udiljak, Dominik, Pufall, Reinhard, Wunderle, Bernhard
Published in 2018 19th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) (01.04.2018)
Published in 2018 19th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) (01.04.2018)
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Conference Proceeding
Plastic deformation and failure modes of moulding compounds during indentation loading and their importance for the quantitative characterisation of adhesion
Pflugler, Nadine, Reuther, Georg M., Goroll, Michael, Pufall, Reinhard, Wunderle, Bernhard
Published in 2019 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) (01.03.2019)
Published in 2019 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) (01.03.2019)
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Conference Proceeding
Prediction of robustness of packages by cohesive zone finite element simulation and verification by non-destructive tests
Pufall, Reinhard, May, Daniel, Wunderle, Bernhard, Reuther, Georg M., Pflugler, Nadine, Udiljak, Dominik
Published in 2019 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) (01.03.2019)
Published in 2019 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) (01.03.2019)
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Conference Proceeding
Temperature-dependent adhesion measurements of die attach materials to moulding compounds and lead frame surfaces enabling robust package designs
Pflugler, Nadine, Pufall, Reinhard, Goroll, Michael, Mahler, Joachim, Reuther, Georg M., Wunderle, Bernhard
Published in 2018 7th Electronic System-Integration Technology Conference (ESTC) (01.09.2018)
Published in 2018 7th Electronic System-Integration Technology Conference (ESTC) (01.09.2018)
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Conference Proceeding
Non-destructive die attach test method for future robust packages - a proposal
Pflugler, Nadine, Pufall, Reinhard, Goroll, Michael, Wunderle, Bernhard
Published in 2016 6th Electronic System-Integration Technology Conference (ESTC) (01.09.2016)
Published in 2016 6th Electronic System-Integration Technology Conference (ESTC) (01.09.2016)
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Conference Proceeding
A novel experimental approach to calibrating cohesive zone elements for advanced risk analysis of interface delamination in semiconductor packages
Reuther, Georg M., Pflugler, Nadine, Udiljak, Dominik, Pufall, Reinhard, Wunderle, Bernhard
Published in 2017 21st European Microelectronics and Packaging Conference (EMPC) & Exhibition (01.09.2017)
Published in 2017 21st European Microelectronics and Packaging Conference (EMPC) & Exhibition (01.09.2017)
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Conference Proceeding