by Pfahnl, A.C., Muller, L.A., Cochran, P.
Published in IEEE transactions on electronics packaging manufacturing (01.10.2000)

by Pfahnl, A.C., Dunn, J., Muller, L.A.
Published in IEEE transactions on electronics packaging manufacturing (01.04.2002)

by Pfahnl, A.C., Muller, L.A., Cochran, P.
Published in IEEE transactions on electronics packaging manufacturing (01.10.2000)

by Pfahnl, A.C.
Published in Thermal and Thermomechanical Proceedings 10th Intersociety Conference on Phenomena in Electronics Systems, 2006. ITHERM 2006 (2006)

by Pfahnl, A.C., Heard, C.S.
Published in Thermal and Thermomechanical Proceedings 10th Intersociety Conference on Phenomena in Electronics Systems, 2006. ITHERM 2006 (2006)

by Pfahnl, A.C., Hsing-Sheng Liang
Published in The Ninth Intersociety Conference on Thermal and Thermomechanical Phenomena In Electronic Systems (IEEE Cat. No.04CH37543) (2004)