Search Results - "Petrarca Kevin S" :: K.UTB vyhledávací portál

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Protected through semiconductor via (TSV)

by Petrarca Kevin S, Oakley Jennifer A, Volant Richard P, Farooq Mukta G
Year of Publication 26.07.2016

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Integrated void fill for through silicon via

by VOLANT RICHARD P, PETRARCA KEVIN S, FAROOQ MUKTA G
Year of Publication 21.01.2014

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Integrated void fill for through silicon via

by VOLANT RICHARD P, PETRARCA KEVIN S, FAROOQ MUKTA G
Year of Publication 17.12.2013

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Method of forming a multi-chip stacked structure including a thin interposer chip having a face-to-back bonding with another chip

by MUKTA G FAROOQ, RICHARD P VOLANT, KEVIN S PETRARCA
Year of Publication 04.09.2013

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Integrated void fill for through silicon via

by VOLANT RICHARD P, PETRARCA KEVIN S, FAROOQ MUKTA G
Year of Publication 04.06.2013

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Soft error rate mitigation by interconnect structure

by MELVILLE IAN D, PETRARCA KEVIN S, FAROOQ MUKTA G
Year of Publication 21.05.2013

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INTEGRATED VOID FILL FOR THROUGH SILICON VIA

by VOLANT RICHARD P, PETRARCA KEVIN S, FAROOQ MUKTA G
Year of Publication 16.05.2013

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Enhanced capture pads for through semiconductor vias

by VOLANT RICHARD P, PETRARCA KEVIN S, LAFONTANT GARY, GRIESEMER JOHN A, FAROOQ MUKTA G
Year of Publication 26.05.2015

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RFID tag with environmental sensor

by ALLEN IRA L, PETRARCA KEVIN S, RADENS CARL J, CLEVENGER LAWRENCE A
Year of Publication 12.05.2015

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Ionizing radiation blocking in IC chip to reduce soft errors

by RODBELL KENNETH P, MELVILLE IAN D, PETRARCA KEVIN S, FAROOQ MUKTA G
Year of Publication 07.04.2015

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Method of forming a multi-chip stacked structure including a thin interposer chip having a face-to-back bonding with another chip

by MUKTA G FAROOQ, RICHARD P VOLANT, KEVIN S PETRARCA
Year of Publication 19.12.2012

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INTEGRATED VOID FILL FOR THROUGH SILICON VIA

by VOLANT RICHARD P, PETRARCA KEVIN S, FAROOQ MUKTA G
Year of Publication 22.11.2012

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Integrated void fill for through silicon via

by MUKTA G FAROOQ, RICHARD P VOLANT, KEVIN S PETRARCA
Year of Publication 26.09.2012

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Patent

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SOFT ERROR RATE MITIGATION BY INTERCONNECT STRUCTURE

by MELVILLE IAN D, PETRARCA KEVIN S, FAROOQ MUKTA G
Year of Publication 31.05.2012

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FRONT SIDE WAFER ID PROCESSING

by IYER SUBRAMANIAN S, PETRARCA KEVIN S, SIEG STUART A, HANNON ROBERT, FAROOQ MUKTA G
Year of Publication 11.09.2014

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Front side wafer ID processing

by IYER SUBRAMANIAN S, PETRARCA KEVIN S, SIEG STUART A, HANNON ROBERT, FAROOQ MUKTA G
Year of Publication 02.09.2014

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Seedless wirebond pad plating

by NARAYAN CHANDRASEKHAR, PETRARCA KEVIN S
Year of Publication 11.01.2007

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RFID TAG WITH ENVIRONMENTAL SENSOR

by ALLEN IRA L, PETRARCA KEVIN S, RADENS CARL J, CLEVENGER LAWRENCE A
Year of Publication 21.08.2014

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Enhanced capture pads for through semiconductor vias

by VOLANT RICHARD P, PETRARCA KEVIN S, LAFONTANT GARY, GRIESEMER JOHN A, FAROOQ MUKTA G
Year of Publication 08.07.2014

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Semiconductor chip with a dual damascene wire and through-substrate via (TSV) structure

by STAMPER ANTHONY K, PETRARCA KEVIN S, GAMBINO JEFFREY P, CHEN FEN, HE ZHONG-XIANG, FAROOQ MUKTA G
Year of Publication 28.07.2015

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