Foveros: 3D Integration and the use of Face-to-Face Chip Stacking for Logic Devices
Ingerly, D. B., Enamul, K., Gomes, W., Jones, D., Kolluru, K. C., Kandas, A., Kim, G.-S., Ma, H., Pantuso, D., Petersburg, C.F., Phen-givoni, M., Amin, S., Pillai, A. M., Sairam, A., Shekhar, P., Sinha, P., Stover, P., Telang, A., Zell, Z., Aryasomayajula, L., Balankutty, A., Borst, D., Chandra, A., Cheemalapati, K., Cook, C. S., Criss, R.
Published in 2019 IEEE International Electron Devices Meeting (IEDM) (01.12.2019)
Published in 2019 IEEE International Electron Devices Meeting (IEDM) (01.12.2019)
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