Signal integrity study of high density through silicon via (TSV) technology
Bok Eng Cheah, Kong, Jackson, Chee Kit Chew, Kooi Chi Ooi, Periaman, Shanggar
Published in 2013 IEEE 15th Electronics Packaging Technology Conference (EPTC 2013) (01.12.2013)
Published in 2013 IEEE 15th Electronics Packaging Technology Conference (EPTC 2013) (01.12.2013)
Get full text
Conference Proceeding
FLEXIBLE PACKAGING ARCHITECTURE
CHEAH BOK ENG, PERIAMAN SHANGGAR, SKINNER MICHAEL, MAR KHENG TAT, ABD RAZAK RIDZA EFFENDI, KONG JACKSON CHUNG PENG, CHEW YEN HSIANG, OOI KOOI CHI
Year of Publication 24.01.2018
Get full text
Year of Publication 24.01.2018
Patent
FLEXIBLE SYSTEM-IN-PACKAGE SOLUTIONS FOR WEARABLE DEVICES
ZHAO JUNFENG, SHE YONG, SKINNER MICHAEL P, CHEAH BOK ENG, PERIAMAN SHANGGAR, TANG JIAMIAO, CHEW YEN HSIANG, SIR JIUN HANN, OOI KOOI CHI
Year of Publication 16.06.2016
Get full text
Year of Publication 16.06.2016
Patent
FLEXIBLE PACKAGING ARCHITECTURE
CHEAH BOK ENG, PERIAMAN SHANGGAR, SKINNER MICHAEL, MAR KHENG TAT, ABD RAZAK RIDZA EFFENDI, KONG JACKSON CHUNG PENG, CHEW YEN HSIANG, OOI KOOI CHI
Year of Publication 02.05.2016
Get full text
Year of Publication 02.05.2016
Patent
Stacked package assembly with voltage reference plane
Cheah, Bok Eng, Kong, Jackson Chung Peng, Ooi, Kooi Chi, Periaman, Shanggar, Ooi, Ping Ping
Year of Publication 03.09.2019
Get full text
Year of Publication 03.09.2019
Patent
STACKED PACKAGE ASSEMBLY WITH VOLTAGE REFERENCE PLANE
CHEAH, Bok Eng, KONG, Jackson, Chung Peng, OOI, Ping Ping, PERIAMAN, Shanggar, OOI, Kooi Chi
Year of Publication 24.07.2019
Get full text
Year of Publication 24.07.2019
Patent
Mehrchiplagenhalbleiterstruktur mit vertikalem Zwischenseitenchip und Halbleiterpaket dafür
Cheah, Bok Eng, Kong, Jackson Chung Peng, Ooi, Kooi Chi, Periaman, Shanggar
Year of Publication 28.09.2023
Get full text
Year of Publication 28.09.2023
Patent
STACKED PACKAGE ASSEMBLY WITH VOLTAGE REFERENCE PLANE
CHEAH, Bok Eng, OOI, Ping Ping, PERIAMAN, Shanggar, KONG, Jackson Chung Peng, OOI, Kooi Chi
Year of Publication 11.10.2018
Get full text
Year of Publication 11.10.2018
Patent
STACKED PACKAGE ASSEMBLY WITH VOLTAGE REFERENCE PLANE
CHEAH, Bok Eng, KONG, Jackson, Chung Peng, OOI, Ping Ping, PERIAMAN, Shanggar, OOI, Kooi Chi
Year of Publication 12.09.2018
Get full text
Year of Publication 12.09.2018
Patent
Flexible packaging architecture
Mar, Kheng Tat, Cheah, Bok Eng, Kong, Jackson Chung Peng, Abd Razak, Ridza Effendi, Ooi, Kooi Chi, Periaman, Shanggar, Skinner, Michael, Chew, Yen Hsiang
Year of Publication 27.08.2019
Get full text
Year of Publication 27.08.2019
Patent