Search Results - "Pepe Angel" :: K.UTB vyhledávací portál

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STAPELBARE SCHICHTEN DIE EINGEKAPSELTE INTEGRIERTE SCHALTUNGSCHIPS MIT EINER ODER MEHREREN DARÜBERLIEGENDEN VERBINDUNGSSCHICHTEN BEINHALTEN UND VERFAHREN ZU DEREN HERSTELLUNG

by YAMAGUCHI, JAMES, PEPE, ANGEL
Year of Publication 15.10.2009

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Stackable layers containing encapsulated integrated circuit chips with one or more overlying interconnect layers and a method of making the same

by PEPE, ANGEL ANTONIO, YAMAGUCHI, JAMES SATSUO
Year of Publication 26.03.2014

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Wire bond through-via structure and method

by Pepe Angel, Boyd W. Eric, Yamaguchi James, Bindrup Randy, Leon John
Year of Publication 22.08.2017

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Three-dimensional module comprised of layers containing IC chips with overlying interconnect layers

by Pepe, Angel, Yamaguchi, James
Year of Publication 03.07.2007

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Three-dimensional module comprised of layers containing IC chips with overlying interconnect layers

by PEPE ANGEL, YAMAGUCHI JAMES
Year of Publication 03.07.2007

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Wire bond through-via structure and method

by Pepe Angel, Boyd W. Eric, Yamaguchi James, Bindrup Randy, Leon John
Year of Publication 30.08.2016

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Stackable layers containing encapsulated integrated circuit chips with one or more overlying interconnect layers and a method of making the same

by PEPE, ANGEL ANTONIO, YAMAGUCHI, JAMES SATSUO
Year of Publication 17.08.2011

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Three-dimensional module comprised of layers containing IC chips with overlying interconnect layers and a method of making the same

by PEPE ANGEL, YAMAGUCHI JAMES
Year of Publication 17.02.2005

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STACKABLE LAYERS CONTAINING ENCAPSULATED INTEGRATED CIRCUIT CHIPS WITH ONE OR MORE OVERLYING INTERCONNECT LAYERS AND A METHOD OF MAKING THE SAME

by YAMAGUCHI, JAMES, SATSUO, PEPE, ANGEL, ANTONIO
Year of Publication 30.09.2009

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Stackable layers containing encapsulated integrated circuit chips with one or more overlying interconnect layers and a method of making the same

by Pepe, Angel, Yamaguchi, James
Year of Publication 10.07.2003

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Stackable layers containing encapsulated integrated circuit chips with one or more overlying interconnect layers and a method of making the same

by PEPE, ANGEL ANTONIO, YAMAGUCHI, JAMES SATSUO
Year of Publication 16.09.2009

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Stackable layers containing encapsulated integrated circuit chips with one or more overlying interconnect layers and a method of making the same

by Pepe, Angel, Yamaguchi, James
Year of Publication 01.05.2003

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STACKABLE LAYERS CONTAINING ENCAPSULATED INTEGRATED CIRCUIT CHIPS WITH ONE OR MORE OVERLYING INTERCONNECT LAYERS AND A METHOD OF MAKING THE SAME

by YAMAGUCHI, JAMES, SATSUO, PEPE, ANGEL, ANTONIO
Year of Publication 15.11.2006

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A METHOD OF STACKING LAYERS CONTAINING ENCAPSULATED INTEGRATED CIRCUIT CHIPS WITH ONE OR MORE OVERLYING INTERCONNECT LAYERS

by YAMAGUCHI, JAMES, SATSUO, PEPE, ANGEL, ANTONIO
Year of Publication 29.12.2005

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STACKABLE LAYERS CONTAINING ENCAPSULATED INTEGRATED CIRCUIT CHIPS WITH ONE OR MORE OVERLYING INTERCONNECT LAYERS AND A METHOD OF MAKING THE SAME

by YAMAGUCHI, JAMES, SATSUO, PEPE, ANGEL, ANTONIO
Year of Publication 21.09.2005

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Method of making stackable layers containing encapsulated integrated circuit chips with one or more overlaying interconnect layers

by Pepe, Angel Antonio, Yamaguchi, James Satsuo
Year of Publication 28.09.2004

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Method of making stackable layers containing encapsulated integrated circuit chips with one or more overlaying interconnect layers

by PEPE ANGEL ANTONIO, YAMAGUCHI JAMES SATSUO
Year of Publication 28.09.2004

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STACKABLE SEMICONDUCTOR CHIP LAYER COMPRISING PREFABRICATED TRENCH INTERCONNECT VIAS

by BOYD W. ERIC, PEPE ANGEL, OZGUZ VOLKAN, ALBERT DOUGLAS, CAMIEN ANDREW, YAMAGUCHI JAMES
Year of Publication 18.11.2010

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Stackable layers containing encapsulated integrated circuit chips with one or more overlying interconnect layers

by PEPE ANGEL ANTONIO, YAMAGUCHI JAMES SATSUO
Year of Publication 31.08.2004

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Stackable layers containing encapsulated integrated circuit chips with one or more overlying interconnect layers

by Pepe, Angel Antonio, Yamaguchi, James Satsuo
Year of Publication 31.08.2004

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