MEMS Devices Including MEMS Dies and Connectors Thereto
Peng, Jung-Huei, Tsai, Hung-Chia, Teng, Yi-Chuan, Cheng, Chun-Wen, Tsai, Shang-Ying
Year of Publication 23.01.2020
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Year of Publication 23.01.2020
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MEMS devices including MEMS dies and connectors thereto
Peng, Jung-Huei, Tsai, Hung-Chia, Teng, Yi-Chuan, Cheng, Chun-Wen, Tsai, Shang-Ying
Year of Publication 17.12.2019
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Year of Publication 17.12.2019
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Method for manufacturing a microphone
Peng, Jung-Huei, Huang, Yao-Te, Hung, Li-Min, Cheng, Chun-wen, Cho, Chin-Yi, Chu, Chia-Hua
Year of Publication 15.09.2020
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Year of Publication 15.09.2020
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METHOD FOR MANUFACTURING A MEMS DEVICE BY FIRST HYBRID BONDING A CMOS WAFER TO A MEMS WAFER
Lin, Hung-Hua, Peng, Jung-Huei, Liu, Ping-Yin, Wu, Chang-Ming, Yu, Chung-Yi
Year of Publication 08.08.2019
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Year of Publication 08.08.2019
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MEMS device with viewer window and manufacturing method thereof
Peng, Jung-Huei, Cheng, Chun-Wen, Chin, Chi-Hang, Chu, Chia-Hua, Tsai, Shang-Ying
Year of Publication 16.07.2019
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Year of Publication 16.07.2019
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INTEGRATIONSVERFAHREN ZUM WAFEREBENENPACKAGING UND MIKROELEKTROMECHANISCHES SYSTEM-, MEMS-, BAUELEMENT
Lin, Hung-Hua, Peng, Jung-Huei, Liu, Ping-Yin, Wu, Chang-Ming, Yu, Chung-Yi
Year of Publication 28.03.2024
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Year of Publication 28.03.2024
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Method for manufacturing a MEMS device by first hybrid bonding a CMOS wafer to a MEMS wafer
Lin, Hung-Hua, Peng, Jung-Huei, Liu, Ping-Yin, Wu, Chang-Ming, Yu, Chung-Yi
Year of Publication 21.05.2019
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Year of Publication 21.05.2019
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Multi-pressure MEMS package
Peng, Jung-Huei, Chang, Kuei-Sung, Liu, Yu-Chia, Cheng, Chun-Wen, Chu, Chia-Hua
Year of Publication 30.04.2019
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Year of Publication 30.04.2019
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a method for manufacturing a mems device by first hybrid bonding a cmos wafer to a mems wafer
Lin, Hung-Hua, Peng, Jung-Huei, Liu, Ping-Yin, Wu, Chang-Ming, Yu, Chung-Yi
Year of Publication 28.03.2019
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Year of Publication 28.03.2019
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MEMS DEVICE WITH VIEWER WINDOW AND MANUFACTURING METHOD THEREOF
TSAI, SHANG-YING, CHIN, CHI-HANG, CHU, CHIA-HUA, CHENG, CHUN-WEN, PENG, JUNG-HUEI
Year of Publication 28.02.2019
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Year of Publication 28.02.2019
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