2.3D Hybrid Substrate with Ajinomoto Build-Up Film for Heterogeneous Integration
Chen, Gary Chang-Fu, Lau, John H, Yang, Channing Cheng-Lin, Huang, Jones Yu-Cheng, Peng, Andy Yan-Jia, Liu, Hsing-Ning, Tseng, Tzyy-Jang, Li, Ming
Published in 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) (01.05.2022)
Published in 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) (01.05.2022)
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Conference Proceeding
Reliability of Heterogeneous Integration on Hybrid Substrate With Ajinomoto Build-Up Film
Yang, Channing Cheng-Lin, Lau, John H, Peng, Andy Yan-Jia, Teng, Vincent, Chen, Gary Chang-Fu, Huang, Jones Yu-Cheng, Chen, YH, Liu, Hsing-Ning, Tseng, Tzyy-Jang, Li, Ming
Published in 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) (01.05.2023)
Published in 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) (01.05.2023)
Get full text
Conference Proceeding