Technology directions for portable computers
Harris, E.P., Depp, S.W., Pence, W.E., Kirkpatrick, S., Sri-Jayantha, M., Troutman, R.R.
Published in Proceedings of the IEEE (01.04.1995)
Published in Proceedings of the IEEE (01.04.1995)
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Journal Article
A 2.4-GHz silicon bipolar oscillator with integrated resonator
Soyuer, M., Jenkins, K.A., Burghartz, J.N., Ainspan, H.A., Canora, F.J., Ponnapalli, S., Ewen, J.F., Pence, W.E.
Published in IEEE journal of solid-state circuits (01.02.1996)
Published in IEEE journal of solid-state circuits (01.02.1996)
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Journal Article
Packaging for wireless communications
Pence, W.E.
Published in Proceedings of 1994 IEEE Electrical Performance of Electronic Packaging (1994)
Published in Proceedings of 1994 IEEE Electrical Performance of Electronic Packaging (1994)
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Conference Proceeding
Opportunities for Standard Silicon Technology in RF&Microwave Applications
Burghartz, J.N., Soyuer, M., Jenkins, K.A., Kwark, Y.H., Ponnapalli, S., Ewen, J.F., Pence, W.E.
Published in ESSDERC '95: Proceedings of the 25th European Solid State Device Research Conference (01.09.1995)
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Published in ESSDERC '95: Proceedings of the 25th European Solid State Device Research Conference (01.09.1995)
Conference Proceeding
New TCE-matched glass-ceramic multi-chip module. II. Materials, mechanical, and thermal aspects
Carrier, G., Francis, G.L., Paisley, R.J., Subrahmanyan, R., Li, C.Y., Pence, W.E., Krusius, J.P., Holleran, L.M.
Published in Proceedings., 39th Electronic Components Conference (1989)
Published in Proceedings., 39th Electronic Components Conference (1989)
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Conference Proceeding
New TCE-matched glass-ceramic multi-chip module. I. Electrical design and characterization
Pence, W.E., Krusius, J.P., Subrahmanyan, R., Li, C.Y., Carrier, G., Francis, G.L., Paisley, R.J., Holleran, L.M.
Published in Proceedings., 39th Electronic Components Conference (1989)
Published in Proceedings., 39th Electronic Components Conference (1989)
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Conference Proceeding