Reliability of ICA attachment of SMDs on inkjet-printed substrates
Niittynen, Juha, Kiilunen, Janne, Putaala, Jussi, Pekkanen, Ville, Mäntysalo, Matti, Jantunen, Heli, Lupo, Donald
Published in Microelectronics and reliability (01.11.2012)
Published in Microelectronics and reliability (01.11.2012)
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Journal Article
Utilizing inkjet printing to fabricate electrical interconnections in a system-in-package
Pekkanen, Ville, Mäntysalo, Matti, Kaija, Kimmo, Mansikkamäki, Pauliina, Kunnari, Esa, Laine, Katja, Niittynen, Juha, Koskinen, Santtu, Halonen, Eerik, Caglar, Umur
Published in Microelectronic engineering (01.11.2010)
Published in Microelectronic engineering (01.11.2010)
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Journal Article
Inkjetting dielectric layer for electronic applications
Kaija, Kimmo, Pekkanen, Ville, Mäntysalo, Matti, Koskinen, Santtu, Niittynen, Juha, Halonen, Eerik, Mansikkamäki, Pauliina
Published in Microelectronic engineering (01.10.2010)
Published in Microelectronic engineering (01.10.2010)
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Journal Article
Functional fluid jetting performance optimization
Pekkanen, Ville, Kaija, Kimmo, Mäntysalo, Matti, Kunnari, Esa, Niittynen, Juha, Mansikkamäki, Pauliina
Published in Microelectronics and reliability (01.06.2010)
Published in Microelectronics and reliability (01.06.2010)
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Journal Article
Controlling warpage of molded package for inkjet manufacturing
Kaija, Kimmo, Pekkanen, Ville, Mäntysalo, Matti, Mansikkamäki, Pauliina
Published in Microelectronic engineering (01.03.2008)
Published in Microelectronic engineering (01.03.2008)
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Journal Article
Characterization of ICA attachment of SMD on inkjet-printed substrates
Niittynen, Juha, Pekkanen, Ville, Mantysalo, Matti
Published in 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC) (01.06.2010)
Published in 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC) (01.06.2010)
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Conference Proceeding
Inkjet printed System-in-Package design and manufacturing
Miettinen, Jani, Pekkanen, Ville, Kaija, Kimmo, Mansikkamäki, Pauliina, Mäntysalo, Juha, Mäntysalo, Matti, Niittynen, Juha, Pekkanen, Jussi, Saviauk, Taavi, Rönkkä, Risto
Published in Microelectronics (01.12.2008)
Published in Microelectronics (01.12.2008)
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Journal Article
Capability of inkjet technology in electronics manufacturing
Mantysalo, M., Pekkanen, V., Kaija, K., Niittynen, J., Koskinen, S., Halonen, E., Mansikkamaki, P., Hameenoja, O.
Published in 2009 59th Electronic Components and Technology Conference (01.05.2009)
Published in 2009 59th Electronic Components and Technology Conference (01.05.2009)
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Conference Proceeding
Usability of Ink‐Jet Printing Technology and Nanomaterials in Electrical Interconnections, Electronic Packaging, and System Integration for Microelectronics Applications
Caglar, Umur, Pekkanen, Ville, Valkama, Jani, Mansikkamäki, Pauliina, Pekkanen, Jussi
Published in Ceramic Integration and Joining Technologies (22.09.2011)
Published in Ceramic Integration and Joining Technologies (22.09.2011)
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Book Chapter
Significance of Conductivity and Thickness of Thin Inkjet Printed Microstrip Lines
Pynttari, V., Makinen, R., Lilja, J., Pekkanen, V., Mansikkamaki, P., Kivikoski, M.
Published in 2008 12th IEEE Workshop on Signal Propagation on Interconnects (01.05.2008)
Published in 2008 12th IEEE Workshop on Signal Propagation on Interconnects (01.05.2008)
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Conference Proceeding
High-frequency characterization and simulation of conductor loss in printable electronics technology
Pynttari, V., Makinen, R., Lilja, J., Pekkanen, V., Mantysalo, M., Mansikkamaki, P., Kivikoski, M.
Published in 2007 IEEE Electrical Performance of Electronic Packaging (01.10.2007)
Published in 2007 IEEE Electrical Performance of Electronic Packaging (01.10.2007)
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Conference Proceeding