A Predictive Model for Whisker Formation Based on Local Microstructure and Grain Boundary Properties
Sarobol, P., Wang, Y., Chen, W. H., Pedigo, A. E., Koppes, J. P., Blendell, J. E., Handwerker, C. A.
Published in JOM (1989) (01.10.2013)
Published in JOM (1989) (01.10.2013)
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Journal Article
Defect Morphology and Texture in Sn, Sn-Cu, and Sn-Cu-Pb Electroplated Films
Sarobol, P, Pedigo, A E, Su, P, Blendell, J E, Handwerker, C A
Published in IEEE transactions on electronics packaging manufacturing (01.07.2010)
Published in IEEE transactions on electronics packaging manufacturing (01.07.2010)
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Journal Article
Whiskers, hillocks, and film stress evolution in electroplated Sn and Sn-Cu films
Pedigo, A.E., Handwerker, C.A., Blendell, J.E.
Published in 2008 58th Electronic Components and Technology Conference (01.05.2008)
Published in 2008 58th Electronic Components and Technology Conference (01.05.2008)
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