Size and constraint effects on interfacial fracture behavior of microscale solder interconnects
Li, B., Zhang, X.P., Yang, Y., Yin, L.M., Pecht, M.G.
Published in Microelectronics and reliability (01.01.2013)
Published in Microelectronics and reliability (01.01.2013)
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Journal Article
Using maintenance options to maximize the benefits of prognostics for wind farms
Haddad, G., Sandborn, P. A., Pecht, M. G.
Published in Wind energy (Chichester, England) (01.05.2014)
Published in Wind energy (Chichester, England) (01.05.2014)
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Journal Article
A life consumption monitoring methodology for electronic systems
Ramakrishnan, A., Pecht, M.G.
Published in IEEE transactions on components and packaging technologies (01.09.2003)
Published in IEEE transactions on components and packaging technologies (01.09.2003)
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Journal Article
Addressing Obsolescence-The Uprating Option
Pecht, M.G., Humphrey, D.
Published in IEEE transactions on components and packaging technologies (01.09.2008)
Published in IEEE transactions on components and packaging technologies (01.09.2008)
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Journal Article
Remaining Useful Life Estimation Based on a Nonlinear Diffusion Degradation Process
Xiao-Sheng Si, Wenbin Wang, Chang-Hua Hu, Dong-Hua Zhou, Pecht, M. G.
Published in IEEE transactions on reliability (01.03.2012)
Published in IEEE transactions on reliability (01.03.2012)
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Journal Article
Electronic part life cycle concepts and obsolescence forecasting
Solomon, R., Sandborn, P.A., Pecht, M.G.
Published in IEEE transactions on components and packaging technologies (01.12.2000)
Published in IEEE transactions on components and packaging technologies (01.12.2000)
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Journal Article
Benefits and Challenges of System Prognostics
Bo Sun, Shengkui Zeng, Rui Kang, Pecht, M. G.
Published in IEEE transactions on reliability (01.06.2012)
Published in IEEE transactions on reliability (01.06.2012)
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Journal Article
High Cycle Cyclic Torsion Fatigue of PBGA Pb-Free Solder Joints
Haiyu Qi, Qian Zhang, Tinsley, E.C., Osterman, M., Pecht, M.G.
Published in IEEE transactions on components and packaging technologies (01.06.2008)
Published in IEEE transactions on components and packaging technologies (01.06.2008)
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Journal Article
Are you ready for lead-free electronics?
Eveloy, V., Ganesan, S., Fukuda, Y., Ji Wu, Pecht, M.G.
Published in IEEE transactions on components and packaging technologies (01.12.2005)
Published in IEEE transactions on components and packaging technologies (01.12.2005)
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Journal Article
Moisture sensitivity characterization of build-up ball grid array substrates
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Journal Article
Conference Proceeding
An Options Approach for Decision Support of Systems With Prognostic Capabilities
Haddad, G., Sandborn, P. A., Pecht, M. G.
Published in IEEE transactions on reliability (01.12.2012)
Published in IEEE transactions on reliability (01.12.2012)
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Journal Article
Ion transport in encapsulants used in microcircuit packaging
Lantz, L., Pecht, M.G.
Published in IEEE transactions on components and packaging technologies (01.03.2003)
Published in IEEE transactions on components and packaging technologies (01.03.2003)
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Journal Article
Online Anomaly Detection for Hard Disk Drives Based on Mahalanobis Distance
Yu Wang, Qiang Miao, Ma, E. W. M., Kwok-Leung Tsui, Pecht, M. G.
Published in IEEE transactions on reliability (01.03.2013)
Published in IEEE transactions on reliability (01.03.2013)
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Journal Article
Lead-free soldering in the Japanese electronics industry
Fukuda, Y., Pecht, M.G., Fukuda, K., Fukuda, S.
Published in IEEE transactions on components and packaging technologies (01.09.2003)
Published in IEEE transactions on components and packaging technologies (01.09.2003)
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Journal Article