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Dickson, T. O., Yong Liu, Rylov, S. V., Bing Dang, Tsang, C. K., Andry, P. S., Bulzacchelli, J. F., Ainspan, H. A., Xiaoxiong Gu, Turlapati, L., Beakes, M. P., Parker, B. D., Knickerbocker, J. U., Friedman, D. J.
Published in IEEE journal of solid-state circuits (01.04.2012)
Published in IEEE journal of solid-state circuits (01.04.2012)
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Atomic-beam alignment of inorganic materials for liquid-crystal displays
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Published in Nature (London) (03.05.2001)
Published in Nature (London) (03.05.2001)
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3-D Silicon Integration and Silicon Packaging Technology Using Silicon Through-Vias
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Published in IEEE journal of solid-state circuits (01.08.2006)
Published in IEEE journal of solid-state circuits (01.08.2006)
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Electroless Deposition of NiB on 15 Inch Glass Substrates for the Fabrication of Transistor Gates for Liquid Crystal Displays
Delamarche, Emmanuel, Geissler, Matthias, Vichiconti, James, Graham, William S, Andry, Paul A, Flake, John C, Fryer, Peter M, Nunes, Ronald W, Michel, Bruno, O'Sullivan, Eugene J, Schmid, Heinz, Wolf, Heiko, Wisnieff, Robert L
Published in Langmuir (08.07.2003)
Published in Langmuir (08.07.2003)
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3-D Die Stacking With 55 μm Pitch Interconnections on Advanced Ground-Rule Laminate for Artificial Intelligence System
Sakuma, Katsuyuki, Farooq, Mukta, Andry, Paul, Cabral, Cyril, Wassick, Thomas, McHerron, Dale, Divakaruni, Rama
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.05.2021)
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.05.2021)
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Knickerbocker, J U, Andry, P S, Dang, B, Horton, R R, Interrante, M J, Patel, C S, Polastre, R J, Sakuma, K, Sirdeshmukh, R, Sprogis, E J, Sri-Jayantha, S M, Stephens, A M, Topol, A W, Tsang, C K, Webb, B C, Wright, S L
Published in IBM journal of research and development (01.11.2008)
Published in IBM journal of research and development (01.11.2008)
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3D chip-stacking technology with through-silicon vias and low-volume lead-free interconnections
Sakuma, K, Andry, P S, Tsang, C K, Wright, S L, Dang, B, Patel, C S, Webb, B C, Maria, J, Sprogis, E J, Kang, S K, Polastre, R J, Horton, R R, Knickerbocker, J U
Published in IBM journal of research and development (01.11.2008)
Published in IBM journal of research and development (01.11.2008)
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Fabrication and characterization of robust through-silicon vias for silicon-carrier applications
Andry, P S, Tsang, C K, Webb, B C, Sprogis, E J, Wright, S L, Dang, B, Manzer, D G
Published in IBM journal of research and development (01.11.2008)
Published in IBM journal of research and development (01.11.2008)
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Development of next-generation system-on-package (SOP) technology based on silicon carriers with fine-pitch chip interconnection
Knickerbocker, J. U., Andry, P. S., Buchwalter, L. P., Deutsch, A., Horton, R. R., Jenkins, K. A., Kwark, Y. H., McVicker, G., Patel, C. S., Polastre, R. J., Schuster, C. D., Sharma, A., Sri-Jayantha, S. M., Surovic, C. W., Tsang, C. K., Webb, B. C., Wright, S. L., McKnight, S. R., Sprogis, E. J., Dang, B.
Published in IBM journal of research and development (01.07.2005)
Published in IBM journal of research and development (01.07.2005)
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Three-Dimensional Chip Stack With Integrated Decoupling Capacitors and Thru-Si Via Interconnects
Bing Dang, Shapiro, M, Andry, P, Tsang, C, Sprogis, E, Wright, S, Interrante, M, Griffith, J, Truong, V, Guerin, L, Liptak, R, Berger, D, Knickerbocker, J
Published in IEEE electron device letters (01.12.2010)
Published in IEEE electron device letters (01.12.2010)
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An 82%-efficient multiphase voltage-regulator 3D interposer with on-chip magnetic inductors
Tien, Kevin, Sturcken, Noah, Naigang Wang, Jae-woong Nah, Bing Dang, O'Sullivan, Eugene, Andry, Paul, Petracca, Michele, Carloni, Luca P., Gallagher, William, Shepard, Kenneth
Published in 2015 Symposium on VLSI Technology (VLSI Technology) (01.06.2015)
Published in 2015 Symposium on VLSI Technology (VLSI Technology) (01.06.2015)
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3D chip stacking with C4 technology
Dang, B, Wright, S L, Andry, P S, Sprogis, E J, Tsang, C K, Interrante, M J, Webb, B C, Polastre, R J, Horton, R R, Patel, C S, Sharma, A, Zheng, J, Sakuma, K, Knickerbocker, J U
Published in IBM journal of research and development (01.11.2008)
Published in IBM journal of research and development (01.11.2008)
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Structure, Design and Process Control for Cu Bonded Interconnects in 3D Integrated Circuits
Kuan-Neng Chen, Sang Hwui Lee, Andry, P.S., Tsang, C.K., Topol, A.W., Yu-Ming Lin, Jian-Qiang Lu, Young, A.M., Meikei Ieong, Haensch, W.
Published in 2006 International Electron Devices Meeting (2006)
Published in 2006 International Electron Devices Meeting (2006)
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ASSEMBLY OF A CHIP TO A SUBSTRATE
Kastberg, Russell, Farooq, Mukta Ghate, Sakuma, Katsuyuki, Andry, Paul S
Year of Publication 22.02.2024
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Year of Publication 22.02.2024
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Assembly of a chip to a substrate
Kastberg, Russell, Farooq, Mukta Ghate, Sakuma, Katsuyuki, Andry, Paul S
Year of Publication 21.11.2023
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Year of Publication 21.11.2023
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Simulation of thermal pulse evolution during laser debonding
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Published in 2015 IEEE 65th Electronic Components and Technology Conference (ECTC) (01.05.2015)
Published in 2015 IEEE 65th Electronic Components and Technology Conference (ECTC) (01.05.2015)
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Direct Bonded Heterogeneous Integration (DBHi) Si Bridge
Sikka, Kamal, Bonam, Ravi, Liu, Yang, Andry, Paul, Parekh, Dishit, Jain, Aakrati, Bergendahl, Marc, Divakaruni, Rama, Cournoyer, Maryse, Gagnon, Pascale, Dufort, Catherine, de Sousa, Isabel, Zhang, Hongqing, Cropp, Ed, Wassick, Thomas, Mori, Hiroyuki, Kohara, Sayuri
Published in 2021 IEEE 71st Electronic Components and Technology Conference (ECTC) (01.06.2021)
Published in 2021 IEEE 71st Electronic Components and Technology Conference (ECTC) (01.06.2021)
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