MULTI-LAYER LASER DEBONDING STRUCTURE WITH TUNABLE ABSORPTION
ANDRY, PAUL, GELORME, JEFFREY, TSANG, CORNELIA, KANG-I, WEBB, BUCKNELL
Year of Publication 12.05.2016
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Year of Publication 12.05.2016
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Double Layer Release Temporary Bond And Debond Processes And Systems
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Year of Publication 18.04.2019
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Year of Publication 18.04.2019
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Methods of forming microelectronic smart tags
Denneau, Monty Montague, Knickerbocker, John U, Andry, Paul S, Wisnieff, Robert L
Year of Publication 24.04.2018
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Year of Publication 24.04.2018
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Three-D power converter in three distinct strata
Wisnieff Robert, Colgan Evan G, Andry Paul S, Chang Leland, Knickerbocker John U, Webb Bucknell C
Year of Publication 10.04.2018
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Year of Publication 10.04.2018
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Handler bonding and debonding for semiconductor dies
Yang, Cornelia Tsang, Dang, Bing, Knickerbocker, John U, Hung, Li-Wen, Gelorme, Jeffrey Donald, Andry, Paul S
Year of Publication 05.03.2019
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Year of Publication 05.03.2019
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Double layer release temporary bond and debond processes and systems
Budd, Russell A, Dang, Bing, Tsang, Cornelia Kang-I, Knickerbocker, John U, Hung, Li-Wen, Andry, Paul S
Year of Publication 05.03.2019
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Year of Publication 05.03.2019
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NiFe-based Ball-limiting-metallurgy (BLM) for microbumps at 50μm pitch in 3D chip stacks
Bing Dang, Wright, Steven, Maria, Joana, Tsang, Cornelia, Andry, Paul, Wiggins, Lovell, Knickerbocker, John
Published in 2013 IEEE 63rd Electronic Components and Technology Conference (01.05.2013)
Published in 2013 IEEE 63rd Electronic Components and Technology Conference (01.05.2013)
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Conference Proceeding
SIMPLIFIED HERMETIC PACKAGING OF A MICRO-BATTERY
ANDRY, Paul, NARASGOND, Adinath, Shantinath, NAH, Jae-Woong, WEBB, Bucknell, LIU, Yang, DANG, Bing, KNICKERBOCKER, John
Year of Publication 16.11.2017
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Year of Publication 16.11.2017
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Feasibility Study of Si Handler Debonding by Laser Release
Bing Dang, Wassick, Tom, Yang Liu, Qianwen Chen, Andry, Paul, Li-Wen Hung, Hongqing Zhang, Gelorme, Jeffrey, Knickerbocker, John
Published in 2016 IEEE 66th Electronic Components and Technology Conference (ECTC) (01.05.2016)
Published in 2016 IEEE 66th Electronic Components and Technology Conference (ECTC) (01.05.2016)
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Conference Proceeding
Dual seal microbattery and method of making
Narasgond, Adinath S, Nah, Jae-Woong, Branquinho Teresa Maria, Joana S, Gelorme, Jeffrey, Webb, Bucknell C, Andry, Paul S
Year of Publication 18.09.2018
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Year of Publication 18.09.2018
Patent
Three dimensional silicon integration using fine pitch interconnection, silicon processing and silicon carrier packaging technology
Knickerbocker, J.U., Patel, C.S., Andry, P.S., Tsang, C.K., Paivikki Buchwalter, L., Sprogis, E., Hua Gan, Horton, R.R., Polastre, R., Wright, S.L., Schuster, C., Baks, C., Doany, F., Rosner, J., Cordes, S.
Published in Proceedings of the IEEE 2005 Custom Integrated Circuits Conference, 2005 (2005)
Published in Proceedings of the IEEE 2005 Custom Integrated Circuits Conference, 2005 (2005)
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Conference Proceeding
Interconnects in the third dimension: design challenges for 3D ICs
Bernstein, Kerry, Andry, Paul, Cann, Jerome, Emma, Phil, Greenberg, David, Haensch, Wilfried, Ignatowski, Mike, Koester, Steve, Magerlein, John, Puri, Ruchir, Young, Albert
Published in 2007 44th ACM/IEEE Design Automation Conference (04.06.2007)
Published in 2007 44th ACM/IEEE Design Automation Conference (04.06.2007)
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Conference Proceeding
THREE-D POWER CONVERTER IN THREE DISTINCT STRATA
Wisnieff Robert, Colgan Evan G, Andry Paul S, Chang Leland, Knickerbocker John U, Webb Bucknell C
Year of Publication 17.08.2017
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Year of Publication 17.08.2017
Patent
HANDLER BONDING AND DEBONDING FOR SEMICONDUCTOR DIES
YANG, Cornelia Tsang, HUNG, Li-Wen, KNICKERBOCKER, John U, ANDRY, Paul S, DANG, Bing, GELORME, Jeffrey Donald
Year of Publication 02.08.2018
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Year of Publication 02.08.2018
Patent
HANDLER BONDING AND DEBONDING FOR SEMICONDUCTOR DIES
ANDRY, Paul, HUNG, Li-Wen, GELORME, Jeffrey, Donald, KNICKERBOCKER, John, DANG, Bing, YANG, Cornelia, Tsang
Year of Publication 06.07.2017
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Year of Publication 06.07.2017
Patent