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200 mm sensor development using bonded wafers
Alyari, M., Bradford, R., Campanella, M., Camporeale, P., Demina, R., Everts, J., Gecse, Z., Halenza, R., Heintz, U., Holland, S., Hong, S., Korjenevski, S., Lampis, A., Lipton, R., Patti, R., Segal, J., Shin, K.W.
Published in Journal of instrumentation (01.02.2021)
Published in Journal of instrumentation (01.02.2021)
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Journal Article