A new probing technique for high-speed/high-density printed circuit boards
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Conference Proceeding
Design, fabrication and use of mixed-signal IC testability structures
Parker, K.P., McDermid, J.E., Browen, R.A., Nuriya, K., Hirayama, K., Matsuzawa, A.
Published in Proceedings - International Test Conference (1997)
Published in Proceedings - International Test Conference (1997)
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Conference Proceeding
Journal Article
Implications of 3-D integrated circuits at board test position paper
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Conference Proceeding
Surviving state disruptions caused by test: The "Lobotomy Problem"
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Conference Proceeding
Testing bridges to nowhere - combining Boundary Scan and capacitive sensing
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Conference Proceeding
Surviving state disruptions caused by test: A case study
Parker, K. P., Kameyama, S., Dubberke, D.
Published in 2011 IEEE International Test Conference (01.09.2011)
Published in 2011 IEEE International Test Conference (01.09.2011)
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Conference Proceeding
A new probing technique for high-speed/high-density printed circuit boards
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Conference Proceeding
Solutions for undetected shorts on IEEE 1149.1 self-monitoring pins
Clark, C J, Dubberke, D, Parker, K P, Tuthill, B
Published in 2010 IEEE International Test Conference (01.11.2010)
Published in 2010 IEEE International Test Conference (01.11.2010)
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Conference Proceeding
Principal Component Analysis-based compensation for measurement errors due to mechanical misalignments in PCB testing
Xin He, Malaiya, Y, Jayasumana, A P, Parker, K P, Hird, S
Published in 2010 IEEE International Test Conference (01.11.2010)
Published in 2010 IEEE International Test Conference (01.11.2010)
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Conference Proceeding
An outlier detection based approach for PCB testing
Xin He, Malaiya, Y., Jayasumana, A.P., Parker, K.P., Hird, S.
Published in 2009 International Test Conference (01.11.2009)
Published in 2009 International Test Conference (01.11.2009)
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Conference Proceeding