by Gu, Xiaoxiong, Liu, Duixian, Baks, Christian, Tageman, Ola, Sadhu, Bodhisatwa, Hallin, Joakim, Rexberg, Leonard, Parida, Pritish, Kwark, Young, Valdes-Garcia, Alberto
Published in IEEE transactions on microwave theory and techniques (01.07.2019)

by Chainer, Timothy J., Schultz, Mark D., Parida, Pritish R., Gaynes, Michael A.
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.08.2017)

by Bar-Cohen, Avram, Asheghi, Mehdi, Chainer, Timothy J., Garimella, Suresh V., Goodson, Kenneth, Gorle, Catherine, Mandel, Raphael, Maurer, Joseph J., Ohadi, Michael, Palko, James W., Parida, Pritish R., Peles, Yoav, Plawsky, Joel L., Schultz, Mark D., Weibel, Justin A., Joshi, Yogendra
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.10.2021)

by Schultz, Mark D., Parida, Pritish R., Chainer, Timothy
Published in 2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm) (31.05.2022)

by Parida, Pritish R., Ekkad, Srinath V., Ngo, Khai
Published in International journal of thermal sciences (01.06.2011)

by Parida, Pritish R., Ekkad, Srinath V., Ngo, Khai
Published in International journal of heat and mass transfer (31.01.2012)

by Parida, Pritish R., Marston, Ken, Drummond, Kevin, Campbell, Levi, Saito, Yuji, Phan, Thanh Long, Ping Wu, Xiao, Wuttijumnong, Vijit
Published in 2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) (01.07.2020)

by Fanghua Mei, Parida, P.R., Jing Jiang, Wen Jin Meng, Ekkad, S.V.
Published in Journal of microelectromechanical systems (01.08.2008)

by Parida, Pritish R., Mei, Fanghua, Jiang, Jing, Meng, Wen Jin, Ekkad, Srinath V.
Published in Heat transfer engineering (01.05.2010)

by Parida, Pritish R.
Published in 2024 23rd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) (28.05.2024)

by Parida, Pritish R., Chainer, Timothy
Published in 2020 36th Semiconductor Thermal Measurement, Modeling & Management Symposium (SEMI-THERM) (01.03.2020)

by Schultz, Mark D., Parida, Pritish R.
Published in 2024 23rd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) (28.05.2024)

by Raj, Rishi, Prasad, Amit, Parida, Pritish Ranjan, Mishra, Subhash C.
Published in Numerical heat transfer. Part A, Applications (01.02.2006)

by Parida, Pritish R., Chainer, Timothy
Published in 2016 15th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) (01.05.2016)

by Parida, Pritish R., Tian, Shurong, Schultz, Mark, Chainer, Timothy
Published in 2024 23rd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) (28.05.2024)

by Parida, Pritish R., Vega, Augusto, Buyuktosunoglu, Alper, Bose, Pradip, Chainer, Timothy
Published in 2016 15th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) (01.05.2016)

by Parida, Pritish R., Sridhar, Arvind, Brunschwiler, Thomas, Chainer, Timothy
Published in 2016 15th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) (01.05.2016)

by Leitao Chen, Fanghao Yang, Parida, Pritish R., Schultz, Mark, Chainer, Timothy
Published in 2016 15th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) (01.05.2016)

by LOUDERMILK, ERIC, Paez, Julio, Bojrab, Louis, Phillips, Gregory, Przkora, Rene, Noles, John, Ibrahim, Mohab, Patwardhan, Amol, Rauck, Richard, Lee, Jennifer, Lee, Albert, Scowcroft, James, Israel, Atef, Miller, Nathan, Chaiban, Gassan, Parida, Pritish, Rogers, Jeffrey, Hershey, Brad, Huynh, Dat, McDonald, Matthew
Published in Neuromodulation (Malden, Mass.) (01.10.2024)

by Eilam, Tamar, Bose, Pradip, Carloni, Luca P., Cidon, Asaf, Franke, Hubertus, Kim, Martha A., Lee, Eun K., Naghshineh, Mahmoud, Parida, Pritish, Stein, Clifford S., Tantawi, Asser N.
Published in IEEE transactions on semiconductor manufacturing (01.11.2024)