Wafer Level Integration of 3-D Heat Sinks in Power ICs
Para, Isabella, Marasso, S. L., Perrone, D., Gentile, M. G., Sanfilippo, C., Richieri, Giovanni, Merlin, Luigi, Pugliese, D., Cocuzza, M., Ferrero, S., Scaltrito, L., Pirri, C. F.
Published in IEEE transactions on electron devices (01.10.2017)
Published in IEEE transactions on electron devices (01.10.2017)
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Journal Article
Back plate electroplating for high aspect ratio processes
Marasso, Simone Luigi, Benetto, Simone, Para, Isabella, Ottone, Chiara, Mombello, Domenico, Perrone, Denis, Ferrero, Sergio, Scaltrito, Luciano, Pugliese, Diego, Cocuzza, Matteo, Pirri, Fabrizio Candido
Published in Microelectronics international (02.05.2017)
Published in Microelectronics international (02.05.2017)
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Journal Article
LOCAL SEMICONDUCTOR WAFER THINNING
RICHIERI, Giovanni, MERLIN, Luigi, PARA, Isabella, CARMELO, Sanfilippo
Year of Publication 08.05.2019
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Year of Publication 08.05.2019
Patent
LOCAL SEMICONDUCTOR WAFER THINNING
RICHIERI, Giovanni, MERLIN, Luigi, PARA, Isabella, CARMELO, Sanfilippo
Year of Publication 22.08.2018
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Year of Publication 22.08.2018
Patent
Local semiconductor wafer thinning
Merlin, Luigi, Richieri, Giovanni, Para, Isabella, Carmelo, Sanfilippo
Year of Publication 07.08.2018
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Year of Publication 07.08.2018
Patent
LOCAL SEMICONDUCTOR WAFER THINNING
RICHIERI, Giovanni, MERLIN, Luigi, PARA, Isabella, CARMELO, Sanfilippo
Year of Publication 20.04.2017
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Year of Publication 20.04.2017
Patent
Local semiconductor wafer thinning
CARMELO, SANFILIPPO, RICHIERI, GIOVANNI, PARA, ISABELLA, MERLIN, LUIGI
Year of Publication 11.08.2018
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Year of Publication 11.08.2018
Patent
Local semiconductor wafer thinning
CARMELO, SANFILIPPO, RICHIERI, GIOVANNI, PARA, ISABELLA, MERLIN, LUIGI
Year of Publication 16.07.2017
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Year of Publication 16.07.2017
Patent