Space mirror deformation: from thermo-mechanical measurements by speckle interferometry to optical comparison with multiphysics simulation
Languy, Fabian, Vandenrijt, Jean-François, Saint-Georges, Philippe, Paquay, Stéphane, De Vincenzo, Pascal, Georges, Marc P
Published in Applied optics. Optical technology and biomedical optics (20.08.2018)
Published in Applied optics. Optical technology and biomedical optics (20.08.2018)
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Journal Article
Modeling and finite element analysis of mechanical behavior of flexible MEMS components
Pustan, Marius, Paquay, Stéphane, Rochus, Véronique, Golinval, Jean-Claude
Published in Microsystem technologies (01.04.2011)
Published in Microsystem technologies (01.04.2011)
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Conference Proceeding
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A stochastic computational multiscale approach; Application to MEMS resonators
Lucas, V., Golinval, J.-C., Paquay, S., Nguyen, V.-D., Noels, L., Wu, L.
Published in Computer methods in applied mechanics and engineering (01.09.2015)
Published in Computer methods in applied mechanics and engineering (01.09.2015)
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A stochastic multi-scale approach for the modeling of thermo-elastic damping in micro-resonators
Wu, L., Lucas, V., Nguyen, V.-D., Golinval, J.-C., Paquay, S., Noels, L.
Published in Computer methods in applied mechanics and engineering (01.10.2016)
Published in Computer methods in applied mechanics and engineering (01.10.2016)
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A computational stochastic multiscale methodology for MEMS structures involving adhesive contact
Hoang, T.-V., Wu, L., Paquay, S., Golinval, J.-C., Arnst, M., Noels, L.
Published in Tribology international (01.06.2017)
Published in Tribology international (01.06.2017)
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A probabilistic model for predicting the uncertainties of the humid stiction phenomenon on hard materials
Hoang, T.-V., Wu, L., Paquay, S., Obreja, A.C., Voicu, R.C., Müller, R., Golinval, J.-C., Noels, L.
Published in Journal of computational and applied mathematics (01.12.2015)
Published in Journal of computational and applied mathematics (01.12.2015)
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A Stochastic Multi-Scale Model for Predicting MEMS Stiction Failure
Hoang, T. V., Wu, L., Paquay, S., Golinval, J.-C., Arnst, M., Noels, L.
Published in Micro and Nanomechanics, Volume 5 (2016)
Published in Micro and Nanomechanics, Volume 5 (2016)
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Book Chapter
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A study of dry stiction phenomenon in MEMS using a computational stochastic multi-scale methodology
Hoang, T.-V, Wu, L., Paquay, S., Golinval, J.-C, Arnst, M., Noels, L.
Published in 2016 17th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) (01.04.2016)
Published in 2016 17th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) (01.04.2016)
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Conference Proceeding
Effects of the electrode positions on the dynamical behaviour of electrostatically actuated MEMS resonators
Pustan, M, Paquay, S, Rochus, V, Golinval, J C
Published in 2011 12th Intl. Conf. on Thermal, Mechanical & Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (01.04.2011)
Published in 2011 12th Intl. Conf. on Thermal, Mechanical & Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (01.04.2011)
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Conference Proceeding
Digital Engineering Hub Pathfinder
Verhoef, Marcel, Gerene, Sam, Vorobiev, Alex, Smiechowski, Nathanael, Jahnke, Stephan, Knippschild, Jan, Weikert, Sven, Becker, Marc, Paquay, Stephane, Vogt, Juan Pablo Hernandez, Fontaine, Ivan
Published in 2021 ACM/IEEE International Conference on Model Driven Engineering Languages and Systems Companion (MODELS-C) (01.10.2021)
Published in 2021 ACM/IEEE International Conference on Model Driven Engineering Languages and Systems Companion (MODELS-C) (01.10.2021)
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Conference Proceeding
Modeling of the Fabrication and Operation of 3-D Self-Assembled SOI MEMS
Mendez, C., Louis, C., Paquay, S., De Vincenzo, P., Klapka, I., Rochus, V., Iker, F., Andre, N., Raskin, J.-P.
Published in EuroSime 2006 - 7th International Conference on Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems (2006)
Published in EuroSime 2006 - 7th International Conference on Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems (2006)
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Conference Proceeding