Fabrication and characterization of fine pitch on-chip copper interconnects for advanced wafer level packaging by a high aspect ratio through AZ9260 resist electroplating
Dixit, Pradeep, Tan, Chee Wee, Xu, Luhua, Lin, Nay, Miao, Jianmin, Pang, John H L, Backus, Petra, Preisser, Robert
Published in Journal of micromechanics and microengineering (01.05.2007)
Published in Journal of micromechanics and microengineering (01.05.2007)
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Clothing polymer fibers with well-aligned and high-aspect ratio carbon nanotubes
Sun, Gengzhi, Zheng, Lianxi, An, Jia, Pan, Yongzheng, Zhou, Jinyuan, Zhan, Zhaoyao, Pang, John H L, Chua, Chee Kai, Leong, Kah Fai, Li, Lin
Published in Nanoscale (01.01.2013)
Published in Nanoscale (01.01.2013)
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Ultra-sensitive and wide-dynamic-range sensors based on dense arrays of carbon nanotube tips
Sun, Gengzhi, Huang, Yinxi, Zheng, Lianxi, Zhan, Zhaoyao, Zhang, Yani, Pang, John H L, Wu, Tom, Chen, Peng
Published in Nanoscale (01.11.2011)
Published in Nanoscale (01.11.2011)
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Journal Article
Influence of Weld Toe Radii on Fatigue Life Prediction
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Conference Proceeding
Intermetallic growth studies on Sn-Ag-Cu lead-free solder joints
PANG, John H. L, LUHUA XU, SHI, X. Q, ZHOU, W, NGOH, S. L
Published in Journal of electronic materials (01.10.2004)
Published in Journal of electronic materials (01.10.2004)
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Conference Proceeding
Journal Article
Electromigration effect on intermetallic growth and Young's modulus in SAC solder joint
LUHUA XU, PANG, John H. L, FEI REN, TU, K. N
Published in Journal of electronic materials (01.12.2006)
Published in Journal of electronic materials (01.12.2006)
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Journal Article
Finite element formulation for a digital image correlation method
Sun, Yaofeng, Pang, John H L, Wong, Chee Khuen, Su, Fei
Published in Applied optics (2004) (01.12.2005)
Published in Applied optics (2004) (01.12.2005)
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Journal Article
Reliable and Large Curvature Actuation from Gradient-Structured Graphene Oxide
Sun, Gengzhi, Pan, Yongzheng, Zhan, Zhaoyao, Zheng, Lianxi, Lu, Jingyu, Pang, John H. L, Li, Lin, Huang, Weimin
Published in Journal of physical chemistry. C (08.12.2011)
Published in Journal of physical chemistry. C (08.12.2011)
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Journal Article
In-situ electromigration study on Sn-Ag-Cu solder joint by digital image speckle analysis
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Conference Proceeding
Journal Article