Chemical effects in chemical mechanical planarization of TaN: investigation of surface reactions in a peroxide-based alkaline slurry using Fourier transform impedance spectroscopy
Gorantla, V.R.K., Emery, S.B., Pandija, S., Babu, S.V., Roy, D.
Published in Materials letters (01.03.2005)
Published in Materials letters (01.03.2005)
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Journal Article
Oxalic Acid as a Complexing Agent in CMP Slurries for Copper
Gorantla, V. R. K., Babel, A., Pandija, S., Babu, S. V.
Published in Electrochemical and solid-state letters (01.01.2005)
Published in Electrochemical and solid-state letters (01.01.2005)
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Journal Article
CHEMICAL EFFECTS IN CHEMICAL MECHANICAL PLANARISATION OF TaN: INVESTIGATION OF SURFACE REACTIONS IN A PEROXIDE-BASED ALKALINE SLURRY USING FOURIER TRANSFORM IMPEDANCE SPECTROSCOPY
Gorantla, V R K, Emery, S B, Pandija, S, Babu, S V, Roy, D
Published in Materials letters (01.01.2005)
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Published in Materials letters (01.01.2005)
Journal Article
Protective layer for gate cap reinforcement
WEI, ANDY CHIH-HUNG, BOUCHE, GUILLAUME, WALLACE, CHARLES, VYAS, SHASHI, PANDIJA, SACHIN
Year of Publication 16.04.2023
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Year of Publication 16.04.2023
Patent
Protective layer for gate cap reinforcement
VYAS SUMEET, BOUCHET GREGORY, WALLACE CHARLES H, PANDIJA SAURABH, WAI ALEXANDER CHI-HOI
Year of Publication 23.12.2022
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Year of Publication 23.12.2022
Patent