Fine-Pitch Copper Nanowire Interconnects for 2.5/3D System Integration
Bickel, Steffen, Quednau, Sebastian, Birlem, Olav, Graff, Andreas, Altmann, Frank, Junghähnel, Manuela, Panchenko, Juliana
Published in Journal of electronic materials (01.08.2024)
Published in Journal of electronic materials (01.08.2024)
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Journal Article
Influence of Heat Treatment on the Quality of Die-to-Wafer Hybrid Bond Interconnects
Wenzel, Laura, Rudolph, Catharina, Shehzad, Adil, Mukhopadhyay, Partha, Fulford, H. Jim, Junghaehnel, Manuela, Panchenko, Juliana
Published in 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) (28.05.2024)
Published in 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) (28.05.2024)
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Conference Proceeding