Design Envelopes and Optical Feature Extraction Techniques for Survivability of SnAg Lead-free Packaging Architectures Under Shock and Vibration
Lall, P., Iyengar, D., Shantaram, S., Pandher, R., Panchagade, D.
Published in IEEE transactions on electronics packaging manufacturing (01.10.2009)
Published in IEEE transactions on electronics packaging manufacturing (01.10.2009)
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Journal Article
Modeling moisture ingress through polyisobutylene-based edge-seals
Kempe, Michael D., Panchagade, Dhananjay, Reese, Matthew O., Dameron, Arrelaine A.
Published in Progress in photovoltaics (01.05.2015)
Published in Progress in photovoltaics (01.05.2015)
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Journal Article
Models for reliability prediction of fine-pitch BGAs and CSPs in shock and drop-impact
Lall, P., Panchagade, D., Yueli Liu, Johnson, W., Suhling, J.
Published in 2004 Proceedings. 54th Electronic Components and Technology Conference (IEEE Cat. No.04CH37546) (2004)
Published in 2004 Proceedings. 54th Electronic Components and Technology Conference (IEEE Cat. No.04CH37546) (2004)
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Conference Proceeding
Modeling thermal fatigue in CPV cell assemblies
Bosco, N., Panchagade, D., Kurtz, S.
Published in 2011 37th IEEE Photovoltaic Specialists Conference (01.06.2011)
Published in 2011 37th IEEE Photovoltaic Specialists Conference (01.06.2011)
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Conference Proceeding
Design envelopes and optical feature extraction techniques for survivability of SnAg leadfree packaging architectures under shock and vibration
Lall, P., Iyengar, D., Shantaram, S., Pandher, R., Panchagade, D., Suhling, J.
Published in 2008 58th Electronic Components and Technology Conference (01.05.2008)
Published in 2008 58th Electronic Components and Technology Conference (01.05.2008)
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Conference Proceeding
Feature extraction and health monitoring using image correlation for survivability of leadfree packaging under shock and vibration
Lall, P., Iyengar, D., Shantaram, S., Gupta, P., Panchagade, D., Suhling, J.
Published in EuroSimE 2008 - International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Micro-Systems (01.04.2008)
Published in EuroSimE 2008 - International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Micro-Systems (01.04.2008)
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Conference Proceeding
High Speed Digital Image Correlation for Transient-Shock Reliability of Electronics
Lall, P., Panchagade, D., Iyengar, D., Shantaram, S., Suhling, J., Schrier, H.
Published in 2007 Proceedings 57th Electronic Components and Technology Conference (01.05.2007)
Published in 2007 Proceedings 57th Electronic Components and Technology Conference (01.05.2007)
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Conference Proceeding
Fault-mode classification for health monitoring of electronics subjected to drop and shock
Lall, P., Gupta, P., Panchagade, D., Angral, A.
Published in 2009 59th Electronic Components and Technology Conference (01.05.2009)
Published in 2009 59th Electronic Components and Technology Conference (01.05.2009)
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Conference Proceeding
Time-frequency and auto-regressive techniques for prognostication of shock-impact reliability of implantable biological electronic systems
Lall, P., Gupta, P., Kulkarni, M., Panchagade, D., Suhling, J., Hofmeister, J.
Published in 2008 58th Electronic Components and Technology Conference (01.05.2008)
Published in 2008 58th Electronic Components and Technology Conference (01.05.2008)
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Conference Proceeding
Life Prediction and Damage Equivalency for Shock Survivability of Electronic Components
Lall, P., Panchagade, D., Iyengar, D., Suhling, J.
Published in Thermal and Thermomechanical Proceedings 10th Intersociety Conference on Phenomena in Electronics Systems, 2006. ITHERM 2006 (2006)
Published in Thermal and Thermomechanical Proceedings 10th Intersociety Conference on Phenomena in Electronics Systems, 2006. ITHERM 2006 (2006)
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Conference Proceeding
Prognostics and condition monitoring of electronics
Lall, P., Gupta, P., Panchagade, D., Kulkarni, M., Suhling, J., Hofmeister, J.
Published in EuroSimE 2009 - 10th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (01.04.2009)
Published in EuroSimE 2009 - 10th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (01.04.2009)
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Conference Proceeding
Development of survivability envelopes for SnAg leadfree packaging architecures under shock and vibration
Lall, P., Iyengar, D., Shantaram, S., Panchagade, D., Suhling, J.
Published in 2008 11th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (01.05.2008)
Published in 2008 11th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (01.05.2008)
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Conference Proceeding