Chitosan Controls Postharvest Decay and Elicits Defense Response in Kiwifruit
Zheng, Fangliang, Zheng, Wenwen, Li, Limei, Pan, Siming, Liu, Meichen, Zhang, Weiwei, Liu, Hongsheng, Zhu, Chunyu
Published in Food and bioprocess technology (01.11.2017)
Published in Food and bioprocess technology (01.11.2017)
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Journal Article
Formulation and Network Model Reduction for Analysis of the Power Distribution Network in a Production-Level Multilayered Printed Circuit Board
Shringarpure, Ketan, Siming Pan, Jingook Kim, Jun Fan, Achkir, Brice, Archambeault, Bruce, Drewniak, James L.
Published in IEEE transactions on electromagnetic compatibility (01.06.2016)
Published in IEEE transactions on electromagnetic compatibility (01.06.2016)
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Journal Article
Modeling and Application of Multi-Port TSV Networks in 3-D IC
Wei Yao, Siming Pan, Achkir, B., Jun Fan, Lei He
Published in IEEE transactions on computer-aided design of integrated circuits and systems (01.04.2013)
Published in IEEE transactions on computer-aided design of integrated circuits and systems (01.04.2013)
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Journal Article
A control strategy for multiphase series capacitor boost converter with automatic current sharing and n-times gain capability
Zhao, Lingling, Sun, Min, Guo, Zehui, Dong, Yan, Pan, Siming, Huang, Qi
Published in Energy reports (01.08.2022)
Published in Energy reports (01.08.2022)
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Journal Article
Optimization of power delivery network design for multiple supply voltages
Siming Pan, Achkir, Brice
Published in 2013 IEEE International Symposium on Electromagnetic Compatibility (01.08.2013)
Published in 2013 IEEE International Symposium on Electromagnetic Compatibility (01.08.2013)
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Conference Proceeding
Coil design for 100 KHz and 6.78 MHz WPT system :Litz and solid wires and winding methods
Jonghyun Cho, Jingdong Sun, Heegon Kim, Jun Fan, Yanling Lu, Siming Pan
Published in 2017 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI) (01.08.2017)
Published in 2017 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI) (01.08.2017)
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Conference Proceeding
Comparative study of transmission lines design for 2.5D silicon interposer
Siming Pan, Achkir, Brice
Published in 2013 IEEE International Symposium on Electromagnetic Compatibility (01.08.2013)
Published in 2013 IEEE International Symposium on Electromagnetic Compatibility (01.08.2013)
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Conference Proceeding
Capacitance Calculation for Via Structures Using an Integral Equation Method Based on Partial Capacitance
Hanfeng Wang, Siming Pan, Jingook Kim, Ruehli, Albert E., Jun Fan
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.12.2013)
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.12.2013)
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Journal Article
De-embedding techniques for transmission lines: An application to measurements of on-chip coplanar traces
Erickson, Nicholas, Jun Fan, Xu Gao, Achkir, Brice, Siming Pan
Published in 2014 IEEE International Symposium on Electromagnetic Compatibility (EMC) (01.08.2014)
Published in 2014 IEEE International Symposium on Electromagnetic Compatibility (EMC) (01.08.2014)
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Conference Proceeding
De-embedding techniques for transmission lines: An exploration, review, and proposal
Erickson, Nicholas, Shringarpure, Ketan, Fan, Jun, Achkir, Brice, Siming Pan, Chulsoon Hwang
Published in 2013 IEEE International Symposium on Electromagnetic Compatibility (01.08.2013)
Published in 2013 IEEE International Symposium on Electromagnetic Compatibility (01.08.2013)
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Conference Proceeding
Fast admittance computation for TSV arrays
Dazhao Liu, Siming Pan, Achkir, B., Jun Fan
Published in 2012 IEEE International Symposium on Electromagnetic Compatibility (01.08.2012)
Published in 2012 IEEE International Symposium on Electromagnetic Compatibility (01.08.2012)
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Conference Proceeding
Equivalent mixed-mode characteristic impedances for differential signal vias
Siming Pan, Jun Fan
Published in 2009 IEEE International Symposium on Electromagnetic Compatibility (01.08.2009)
Published in 2009 IEEE International Symposium on Electromagnetic Compatibility (01.08.2009)
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Conference Proceeding
Analytical expressions for transfer function of supply voltage fluctuation to jitter at a single-ended buffer
Jingook Kim, Soumya De, Shringarpure, K., Siming Pan, Achkir, B., Jun Fan, Drewniak, J. L.
Published in 2011 IEEE International Symposium on Electromagnetic Compatibility (01.08.2011)
Published in 2011 IEEE International Symposium on Electromagnetic Compatibility (01.08.2011)
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Conference Proceeding
An equivalent three-dipole model for IC radiated emissions based on TEM cell measurements
Siming Pan, Jingook Kim, Sungnam Kim, Jaesu Park, Heoncheol Oh, Jun Fan
Published in 2010 IEEE International Symposium on Electromagnetic Compatibility (01.07.2010)
Published in 2010 IEEE International Symposium on Electromagnetic Compatibility (01.07.2010)
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Conference Proceeding
Equivalent transmission-line model for vias connected to striplines in multilayer print circuit boards
Siming Pan, Jianmin Zhang, Chen, Q B, Jun Fan
Published in 2010 IEEE International Symposium on Electromagnetic Compatibility (01.07.2010)
Published in 2010 IEEE International Symposium on Electromagnetic Compatibility (01.07.2010)
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Conference Proceeding
Applying feature selective validation (FSV) as an objective function for data optimization
Siming Pan, Hanfeng Wang, Jun Fan
Published in 2010 IEEE International Symposium on Electromagnetic Compatibility (01.07.2010)
Published in 2010 IEEE International Symposium on Electromagnetic Compatibility (01.07.2010)
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Conference Proceeding
Comparison among different via models based on Feature Selective Validation technique
Siming Pan, Hanfeng Wang, Jun Fan
Published in 2009 IEEE International Symposium on Electromagnetic Compatibility (01.08.2009)
Published in 2009 IEEE International Symposium on Electromagnetic Compatibility (01.08.2009)
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Conference Proceeding