The Effect of Solder Joint Microstructure on the Drop Test Failure-A Peridynamic Analysis
Mehrmashhadi, Javad, Tang, Yuye, Zhao, Xiaoliang, Xu, Zhanping, Pan, Jianbiao John, Le, Quang Van, Bobaru, Florin
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.01.2019)
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.01.2019)
Get full text
Journal Article