Analyses of Via-In-Pad Plated Over (VIPPO) and Dogbone in Fanout Routing High-Density Interconnects
Zhang, Yanyan, Tang, Junyan, Duan, Xiaomin, Datta, Srijan, Paladhi, Pavel R., Bohra, Mahesh, Chun, Sungjun, Dreps, Daniel M.
Published in 2023 IEEE 32nd Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) (15.10.2023)
Published in 2023 IEEE 32nd Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) (15.10.2023)
Get full text
Conference Proceeding
Comparison of Invertible Architectures for High Speed Channel Design
Bhatti, Osama Waqar, Akinwande, Oluwaseyi, Ambasana, Nikita, Yang, Xianbo, Paladhi, Pavel R., Becker, Wiren Dale, Swaminathan, Madhavan
Published in 2021 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS) (13.12.2021)
Published in 2021 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS) (13.12.2021)
Get full text
Conference Proceeding
Analysis of Differential Stripline Routing Approaches within a PCB Via Field for Crosstalk Mitigation
Datta, Srijan, Wang, Yuechen, Tang, Junyan, Yang, Xianbo, Zhang, Yanyan, Paladhi, Pavel R., Bohra, Mahesh, Myers, Joshua C., Chun, Sungjun, Dreps, Daniel M.
Published in 2023 IEEE 32nd Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) (15.10.2023)
Published in 2023 IEEE 32nd Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) (15.10.2023)
Get full text
Conference Proceeding
Invertible Neural Networks for High-Speed Channel Design & Parameter Distribution Estimation
Ambasana, Nikita, Bhatti, Osama W., Dolatsara, Majid A., Swaminathan, Madhavan, Yang, Xianbo, Paladhi, Pavel R., Becker, Wiren Dale
Published in 2021 IEEE 30th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) (17.10.2021)
Published in 2021 IEEE 30th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) (17.10.2021)
Get full text
Conference Proceeding
Signal Integrity Characterization of Channels With Asymmetric Via Stubs
Zhang, Yanyan, Bohra, Mahesh, Pham, Nam, Paladhi, Pavel R., Becker, Wiren D., Dreps, Daniel M.
Published in 2020 IEEE 29th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) (01.10.2020)
Published in 2020 IEEE 29th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) (01.10.2020)
Get full text
Conference Proceeding
An Approach For Tuning Signal Integrity Properties Of Edge Card Connectors With Conductive Fixture In High-Speed Link Channels
Zhang, Yanyan, Hejase, Jose A., Bohra, Mahesh, Paladhi, Pavel R., Shan, Lei, Chun, Sungjun, Audet, Jean J., Becker, Wiren D., Dreps, Daniel M.
Published in 2019 IEEE 28th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) (01.10.2019)
Published in 2019 IEEE 28th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) (01.10.2019)
Get full text
Conference Proceeding
Vertical and Horizontal Transitions of Substrate Integrated Waveguides Within a Multi-Layered PCB for High Speed Signaling Applications
Myers, Joshua C., Hejase, Jose A., Tang, Junyan, Paladhi, Pavel R., Becker, Wiren D., Chun, Sungjun, Dreps, Daniel M.
Published in 2018 IEEE 27th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) (01.10.2018)
Published in 2018 IEEE 27th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) (01.10.2018)
Get full text
Conference Proceeding
Terahertz packaging: Study of substrates for novel component designs
Hejase, Jose A, Paladhi, Pavel R, Chahal, Prem
Published in 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC) (01.06.2010)
Published in 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC) (01.06.2010)
Get full text
Conference Proceeding
Corrections to "Terahertz Characterization of Dielectric Substrates for Component Design and Nondestructive Evaluation of Packages" [Nov 11 1685-1694]
Hejase, Jose A., Paladhi, Pavel R., Chahal, Premjeet Prem
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.02.2013)
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.02.2013)
Get full text
Journal Article