TYPE-3 PRINTED CIRCUIT BOARDS (PCBS) WITH HYBRID LAYER COUNTS
Padmanabhan, Sushil, Chuah, Tin Poay, Singh, Navneet Kumar, Arumanayagam, Rajasekar, Pious, Aiswarya M
Year of Publication 07.06.2023
Get full text
Year of Publication 07.06.2023
Patent
PACKAGE ARCHITECTURES WITH GLASS CORES FOR THICKNESS REDUCTION AND 3D INTEGRATION
NAD, Suddhasattwa, DUAN, Gang, SINGH, Navneet, PADMANABHAN, Sushil, PIETAMBARAM, Srinivas V, ALVA, Samarth, ECTON, Jeremy D, MAHAJAN, Ravindranath V, MARIN, Brandon C
Year of Publication 22.02.2024
Get full text
Year of Publication 22.02.2024
Patent
TYPE-3 PRINTED CIRCUIT BOARDS (PCBS) WITH HYBRID LAYER COUNTS
Rajasekar, Arumanayagam, Padmanabhan, Sushil, Chuah, Tin Poay, Singh, Navneet Kumar, Pious, Aiswarya M
Year of Publication 24.03.2022
Get full text
Year of Publication 24.03.2022
Patent
MEMORY MODULE CONNECTOR FOR THIN COMPUTING SYSTEMS
KUMAR, Amarjeet, GANGULY, Konika, SINGH, Navneet Kumar, PADMANABHAN, Sushil, HADA, Gaurav, PIOUS, Aiswarya M, JANGILI GANGA, Siva Prasad, PERRY, Richard S
Year of Publication 10.03.2022
Get full text
Year of Publication 10.03.2022
Patent